SCHEMBL2406643

SCHEMBL2406643

NC(=O)CCCCC(=O)N1CCCCCC1.NC(=O)c1cccc(C(=O)N2CCCCCC2)c1

nearest known ligand 0.51

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
HPGD P15428 5/20 0.51
LMNA P02545 1/20 0.48
POLB P06746 1/20 0.48
GAA P10253 3/20 0.47
ALDH1A1 P00352 2/20 0.47
L3MBTL3 Q96JM7 1/20 0.46
L3MBTL1 Q9Y468 1/20 0.46
SMN1; SMN2 Q16637 2/20 0.45
NPC1 O15118 1/20 0.45
RAB9A P51151 1/20 0.45
TSHR P16473 2/20 0.44
KMT2A Q03164 2/20 0.44
MAPK1 P28482 1/20 0.44
MEN1 O00255 1/20 0.44
HTT P42858 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL538630 0.96 HPGD (0.48) HPGDLMNAPOLBGAAALDH1A1
SCHEMBL729295 0.95 HPGD (0.49) HPGDLMNAPOLBALDH1A1SMN1; SMN2
SCHEMBL690047 0.95 HPGD (0.56) HPGDLMNAPOLBGAAALDH1A1
SCHEMBL9952624 0.91 HPGD (0.53) HPGDLMNAPOLBGAAALDH1A1
SCHEMBL8848524 0.91 HPGD (0.45) HPGDLMNAPOLBGAAALDH1A1
SCHEMBL1159864 0.90 HPGD (0.43) HPGDLMNAPOLBGAAALDH1A1
SCHEMBL7946198 0.90 HPGD (0.54) HPGDLMNAPOLBGAAALDH1A1
SCHEMBL7937028 0.89 HPGD (0.53) HPGDLMNAPOLBGAAALDH1A1
SCHEMBL538956 0.87 HPGD (0.57) HPGDLMNAALDH1A1L3MBTL1SMN1; SMN2
SCHEMBL1193530 0.87 HPGD (0.57) HPGDLMNAALDH1A1L3MBTL1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117730115-A Novel modified polyalkyleneimines as dyeing auxiliary 巴斯夫欧洲公司 2024-03-19 CN disclosed
CN-117207607-A Bubble-free composite molding 霍尼韦尔国际公司 2023-12-12 CN disclosed
CN-112074406-B Laminated film, package and method for oxygen sensitive materials 艾德凡斯化学公司 2023-06-16 CN disclosed
CN-115698150-A Composite polymer film 杜邦帝人薄膜美国有限合伙 2023-02-03 CN disclosed
CN-115485322-A Method for preparing compatibilized blends from blends of polymeric materials 克里奥瓦克公司 2022-12-16 CN disclosed
CN-114555362-A Elastomer containing multilayer film and manufacturing method 克里奥瓦克公司 2022-05-27 CN disclosed
CN-110418813-B Coated fibers and methods 巴斯夫欧洲公司 2022-05-24 CN disclosed
CN-110177688-B Improved peel strength between dissimilar fabrics 霍尼韦尔国际公司 2021-12-07 CN disclosed
CN-109196299-B High buoyancy composite material 霍尼韦尔国际公司 2021-11-09 CN disclosed
US-10874994-B2 Membrane surface activation to eliminate fouling and concentration polarization in water purification systems THE PENN STATE RESEARCH FOUNDATION (US) 2020-12-29 US disclosed
EP-1056806-A1 POLYOLEFIN GRAFT COPOLYMER/POLYAMIDE BLEND Montell Technology Company B.V. (NL) 2000-12-06 EP disclosed
WO-2000036011-A1 POLYOLEFIN GRAFT COPOLYMER/POLYAMIDE BLEND MONTELL TECHNOLOGY COMPANY B.V. (US) 2000-06-22 WO disclosed
EP-0435023-B1 Method for removing volatile substances from polyphenylene ether resin blends GEN ELECTRIC (US) 1998-06-10 EP disclosed
EP-0812869-A2 Improved polyphthalamide composition AMOCO CORPORATION (US) 1997-12-17 EP disclosed
US-5387645-A Synergistic blend of polyamide, functionalized polyolefin and functionalized styrene blocks and rubber blocks of ethylene, propylene, butylene and pentylene; maleic anhydride-modified AMOCO CORPORATION (US) 1995-02-07 US disclosed
US-5128073-A EXPANDING THERMOPLASTIC RESIN BEADS WITH VERY HIGH FREQUENCY ENERGY GENERAL ELECTRIC COMPANY (US) 1992-07-07 US disclosed
US-5102591-A Blending with second polymer; injecting water, venting; odorless GENERAL ELECTRIC COMPANY (US) 1992-04-07 US disclosed
EP-0477027-A2 Improved polyphthalamide composition AMOCO CORPORATION (US) 1992-03-25 EP disclosed
EP-0435023-A2 Method for removing volatile substances from polyphenylene ether resin blends GENERAL ELECTRIC COMPANY (US) 1991-07-03 EP disclosed
EP-0425886-A2 Expanding thermoplastic resin beads with very high frequency energy GENERAL ELECTRIC COMPANY (US) 1991-05-08 EP disclosed