SCHEMBL24177752

SCHEMBL24177752

CC1(OC(=O)CN2CCOCC2)CCC(=O)OC1

nearest known ligand 0.39

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
HSD17B10 Q99714 2/20 0.39
TSHR P16473 2/20 0.39
ALOX15 P16050 1/20 0.39
KDM4E B2RXH2 4/20 0.36
MEN1 O00255 3/20 0.36
KMT2A Q03164 3/20 0.36
POLB P06746 1/20 0.36
ALDH1A1 P00352 4/20 0.35
MAPK1 P28482 2/20 0.35
SMN1; SMN2 Q16637 2/20 0.34
MAPT P10636 1/20 0.34
PKM P14618 1/20 0.33
CYP1A2 P05177 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24177782 0.78 HSD17B10 (0.47) HSD17B10TSHRALOX15KDM4EMEN1
SCHEMBL24177766 0.76 HSD17B10 (0.46) HSD17B10TSHRALOX15KDM4EMEN1
SCHEMBL12551138 0.73
SCHEMBL1900483 0.68 PRKCA (0.30)
SCHEMBL1773811 0.68 KMT2A (0.31) KMT2AALDH1A1
SCHEMBL29016015 0.68 KDM4E (0.40) HSD17B10TSHRALOX15KDM4EMEN1
SCHEMBL10064113 0.68
SCHEMBL10040420 0.68
SCHEMBL26457561 0.68 KDM4E (0.37) HSD17B10TSHRALOX15KDM4EMEN1
SCHEMBL1243105 0.67 KDM4E (0.46) HSD17B10TSHRALOX15KDM4EMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230152692-A1 CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-18 US disclosed
US-20230152692-A1 CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-18 US disclosed
US-20220004101-A1 CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-01-06 US disclosed