SCHEMBL2432224

SCHEMBL2432224

Cc1c[nH]c(-c2ccccc2O)n1

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 5/20 0.57
HPGD P15428 4/20 0.57
HSD17B10 Q99714 2/20 0.57
MGAM O43451 2/20 0.47
GAA P10253 2/20 0.47
SI P14410 1/20 0.47
MGAM2 Q2M2H8 1/20 0.47
DCUN1D1 Q96GG9 2/20 0.47
IDO1 P14902 3/20 0.44
KMT2A Q03164 3/20 0.44
ADORA2A P29274 1/20 0.44
ALDH1A1 P00352 4/20 0.42
MEN1 O00255 2/20 0.42
MAPT P10636 2/20 0.42
NPC1 O15118 1/20 0.42
GLA P06280 1/20 0.42
POLB P06746 1/20 0.42
RECQL P46063 1/20 0.42
TDO2 P48775 1/20 0.42
RAB9A P51151 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31429567 0.86 MGAM (0.51) KDM4EHPGDHSD17B10MGAMGAA
Hydrochloric Acid SCHEMBL4345831 0.82 HPGD (0.38) KDM4EHPGDHSD17B10MGAMGAA
SCHEMBL24360032 0.81 DCUN1D1 (0.50) KDM4EHPGDHSD17B10GAADCUN1D1
SCHEMBL31429602 0.80 GRK6 (0.43) KDM4EHPGDHSD17B10MGAMGAA
SCHEMBL31429584 0.80 IDO1 (0.50) KDM4EHPGDHSD17B10IDO1KMT2A
SCHEMBL8986487 0.79 DCUN1D1 (0.49) KDM4EHPGDHSD17B10MGAMGAA
SCHEMBL31429722 0.79 IDO1 (0.50) KDM4EHPGDHSD17B10GAAIDO1
SCHEMBL31429555 0.79 AMY1A (0.51) KDM4EHPGDHSD17B10MGAMGAA
SCHEMBL31429629 0.79 MGAM (0.44) KDM4EHPGDHSD17B10MGAMGAA
SCHEMBL31429661 0.79 AMY1A (0.44) KDM4EHPGDHSD17B10IDO1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-23 US claimed
WO-2025121026-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, RESIN FILM, AND SEMICONDUCTOR DEVICE 旭化成株式会社 2025-06-12 WO claimed
WO-2025058018-A1 COMPOUND 旭化成株式会社 2025-03-20 WO claimed
WO-2025009354-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE 旭化成株式会社 2025-01-09 WO claimed
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
WO-2025121026-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, RESIN FILM, AND SEMICONDUCTOR DEVICE 旭化成株式会社 2025-06-12 WO disclosed
WO-2025058018-A1 COMPOUND 旭化成株式会社 2025-03-20 WO disclosed
WO-2025009354-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE 旭化成株式会社 2025-01-09 WO disclosed
EP-3288951-A1 FOUR-COORDINATE BORON COMPOUNDS Dow Global Technologies LLC (US) 2018-03-07 EP disclosed
WO-2016178827-A1 FOUR-COORDINATE BORON COMPOUNDS DOW GLOBAL TECHNOLOGIES LLC (US) 2016-11-10 WO disclosed
WO-2014200757-A1 PROTECTED SCALE INHIBITORS AND METHODS RELATING THERETO HALLIBURTON ENERGY SERVICES, INC. (US) 2014-12-18 WO disclosed
US-8389328-B2 Method of manufacturing electronic device and electronic device SUMITOMO BAKELITE CO., LTD. (JP) 2013-03-05 US disclosed
EP-2384103-A1 ELECTRONIC DEVICE MANUFACTURING METHOD AND ELECTRONIC DEVICE Sumitomo Bakelite Company Limited (JP) 2011-11-02 EP disclosed
US-20110221075-A1 METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2011-09-15 US disclosed
WO-2006066260-A9 COMPOSITIONS OF AND METHODS FOR PRODUCING PHOSPHORUS-CHIRAL MONOMERS AND OLIGOMERS THIOSENSE INC (US) 2006-08-17 WO disclosed
WO-2006066260-A2 COMPOSITIONS OF AND METHODS FOR PRODUCING PHOSPHORUS-CHIRAL MONOMERS AND OLIGOMERS THIOSENSE, INC. (US) 2006-06-22 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASH2L, DOT1L, ASH1L KDM4E 160/4885HPGD 2036/4885HSD17B10 2317/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.