Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAOA | P21397 | 1/20 | 0.65 |
| ▸ | MAP4K4 | O95819 | 3/20 | 0.59 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.52 |
| ▸ | CASP1 | P29466 | 1/20 | 0.52 |
| ▸ | RECQL | P46063 | 1/20 | 0.52 |
| ▸ | MAPT | P10636 | 3/20 | 0.49 |
| ▸ | BRD4 | O60885 | 1/20 | 0.49 |
| ▸ | MEN1 | O00255 | 4/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.48 |
| ▸ | LMNA | P02545 | 3/20 | 0.48 |
| ▸ | HPGD | P15428 | 3/20 | 0.48 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.48 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.48 |
| ▸ | MECP2 | P51608 | 1/20 | 0.48 |
| ▸ | PSIP1 | O75475 | 1/20 | 0.47 |
| ▸ | AXL | P30530 | 1/20 | 0.47 |
| ▸ | MKNK1 | Q9BUB5 | 1/20 | 0.47 |
| ▸ | MKNK2 | Q9HBH9 | 1/20 | 0.47 |
| ▸ | PTPRC | P08575 | 2/20 | 0.45 |
| ▸ | NPC1 | O15118 | 2/20 | 0.45 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29471388 | 0.97 | MAOA (0.68) | MAOAMAP4K4CYP3A4CASP1RECQL | |
| SCHEMBL2023695 | 0.97 | MAOA (0.68) | MAOAMAP4K4CYP3A4CASP1RECQL | |
| SCHEMBL7642404 | 0.93 | MAOA (0.70) | MAOAMAP4K4CYP3A4CASP1RECQL | |
| SCHEMBL29726725 | 0.93 | MAOA (0.70) | MAOAMAP4K4CYP3A4CASP1RECQL | |
| SCHEMBL30449021 | 0.93 | MAOA (0.70) | MAOAMAP4K4CYP3A4CASP1RECQL | |
| Ethane SCHEMBL28326570 | 0.93 | MAOA (0.62) | MAOAMAP4K4CYP3A4CASP1RECQL | |
| SCHEMBL7642833 | 0.91 | MAOA (0.56) | MAOAMAP4K4CYP3A4CASP1RECQL | |
| SCHEMBL27336143 | 0.89 | MAOA (0.58) | MAOAMAP4K4CYP3A4CASP1RECQL | |
| SCHEMBL8341652 | 0.88 | MAOA (0.57) | MAOAMAP4K4CYP3A4CASP1RECQL | |
| SCHEMBL1099351 | 0.88 | MAOA (0.57) | MAOAMAP4K4CYP3A4CASP1RECQL |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 66 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5399655-A | Acid-labile poly(amic acetal ester) | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1995-03-21 | — | — | US | claimed |
| EP-3392292-B1 | METHOD FOR PRODUCING HETEROCYCLE-CONTAINING POLYMER PRECURSOR, HETEROCYCLE-CONTAINING POLYMER PRECURSOR, AND USE FOR SAME | FUJIFILM CORP (JP) | 2023-06-28 | — | — | EP | disclosed |
| CN-109313397-B | Method for manufacturing laminate, method for manufacturing semiconductor element, and laminate | 富士胶片株式会社 | 2023-04-11 | — | — | CN | disclosed |
| EP-2006086-B1 | PROCESS FOR PRODUCTION OF SOFT MAGNETIC METAL STRIP LAMINATE | HITACHI METALS LTD (JP) | 2019-07-31 | — | — | EP | disclosed |
| EP-3392292-A1 | METHOD FOR PRODUCING HETEROCYCLE-CONTAINING POLYMER PRECURSOR, HETEROCYCLE-CONTAINING POLYMER PRECURSOR, AND USE FOR SAME | FUJIFILM Corporation (JP) | 2018-10-24 | — | — | EP | disclosed |
| EP-3162868-A1 | THERMAL BASE GENERATOR, THERMOSETTING RESIN COMPOSITION, CURED FILM, CURED FILM MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2017-05-03 | — | — | EP | disclosed |
| EP-2128193-B1 | POROUS POLYIMIDE | IBIDEN CO LTD (JP) | 2013-06-19 | — | — | EP | disclosed |
| US-8022110-B2 | Porous polyimide | IBIDEN CO., LTD. (JP) | 2011-09-20 | — | — | US | disclosed |
| US-20100048745-A1 | POROUS POLYIMIDE | IBIDEN CO., LTD (JP) | 2010-02-25 | — | — | US | disclosed |
| EP-2128193-A1 | POROUS POLYIMIDE | Ibiden Co., Ltd. (JP) | 2009-12-02 | — | — | EP | disclosed |
| US-5120573-A | PROCESS FOR PRODUCING METAL/POLYIMIDE COMPOSITE ARTICLE | HITACHI, LTD. (JP) | 1992-06-09 | — | — | US | disclosed |
| EP-0479148-A2 | Polyimide copolymer precursors | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1992-04-08 | — | — | EP | disclosed |
| EP-0459395-A2 | Positive photo-sensitive resin composition | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1991-12-04 | — | — | EP | disclosed |
| EP-0297139-B1 | FLEXIBLE PRINTED CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 1990-12-27 | — | — | EP | disclosed |
| US-4939039-A | Noncurlling, polyamideimides | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 1990-07-03 | — | — | US | disclosed |
| US-4847353-A | POLYAMIDEIMIDE COPOLYMERS | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 1989-07-11 | — | — | US | disclosed |
| US-4760126-A | Fluorine-containing polyamide-acid derivative and polyimide | HITACHI, LTD. (JP) | 1988-07-26 | — | — | US | disclosed |
| US-4641924-A | Liquid crystal device | HITACHI, LTD. (JP) | 1987-02-10 | — | — | US | disclosed |
| EP-0142149-A2 | Use of fluorine containing polyimides for aligning layers of liquid crystal display devices. | HITACHI, LTD. (JP) | 1985-05-22 | — | — | EP | disclosed |
| EP-0133533-A2 | Low thermal expansion resin material for a wiring insulating film. | HITACHI, LTD. (JP) | 1985-02-27 | — | — | EP | disclosed |