SCHEMBL2466492

SCHEMBL2466492

C=C(CC)C(=O)O[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1923846 0.80 ALDH1A1 (0.37)
SCHEMBL4968892 0.80
SCHEMBL8885527 0.78 ALDH1A1 (0.35)
SCHEMBL8953258 0.78 ALDH1A1 (0.35)
SCHEMBL1514197 0.77 CES1 (0.42)
SCHEMBL10941331 0.76 FFAR3 (0.40)
SCHEMBL997396 0.76 SOAT1 (0.38)
SCHEMBL4762931 0.76
SCHEMBL180796 0.76
SCHEMBL146425 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111138824-B Impact-resistant halogen-free flame-retardant PC/ABS (polycarbonate/acrylonitrile-butadiene-styrene) blend alloy and preparation method thereof 宁波多普达聚合物有限公司 2022-05-27 CN claimed
CN-111138824-A Impact-resistant halogen-free flame-retardant PC/ABS (polycarbonate/acrylonitrile-butadiene-styrene) blend alloy and preparation method thereof 宁波多普达聚合物有限公司 2020-05-12 CN claimed
EP-2617767-B1 Copier/printer exerior part using halogen-free flame-retardant resin composition including recycled polycarbonate and recycled polyethylene terephthalate KONICA MINOLTA BUSINESS TECH (JP) 2015-09-16 EP claimed
US-8865795-B1 Copier/printer exterior part using halogen-free flame-retardant resin composition including recycled polycarbonate and recycled polyethylene terephthalate KONICA MINOLTA BUSINESS TECHNOLOGIES, INC. (JP) 2014-10-21 US claimed
US-20140296383-A1 COPIER/PRINTER EXTERIOR PART USING HALOGEN-FREE FLAME-RETARDANT RESIN COMPOSITION INCLUDING RECYCLED POLYCARBONATE AND RECYCLED POLYETHYLENE TEREPHTHALATE SHANGHAI KUMHOSUNNY PLASTICS CO., LTD. (CN) 2014-10-02 US claimed
US-20130237644-A1 COPIER/PRINTER EXTERIOR PART USING HALOGEN-FREE FLAME-RETARDANT RESIN COMPOSITION INCLUDING RECYCLED POLYCARBONATE AND RECYCLED POLYETHYLENE TEREPHTHALATE KONICA MINOLTA BUSINESS TECHNOLOGIES, INC. (JP) 2013-09-12 US claimed
EP-2617767-A1 Copier/printer exerior part using halogen-free flame-retardant resin composition including recycled polycarbonate and recycled polyethylene terephthalate Konica Minolta Business Technologies, Inc. (JP) 2013-07-24 EP claimed
EP-4195462-A1 INSULATING MATERIAL FOR STATOR, STATOR, AND METHOD FOR MANUFACTURING STATOR Showa Denko Materials Co., Ltd. (JP) 2023-06-14 EP disclosed
CN-111138824-B Impact-resistant halogen-free flame-retardant PC/ABS (polycarbonate/acrylonitrile-butadiene-styrene) blend alloy and preparation method thereof 宁波多普达聚合物有限公司 2022-05-27 CN disclosed
CN-111234496-B Low-humidity-sensitivity regenerated PC/PET composite material and preparation method thereof 宁波坚锋新材料有限公司 2022-05-03 CN disclosed
CN-108641267-B Cable material and preparation method and application thereof 东莞市通锦新材料科技有限公司 2021-10-15 CN disclosed
CN-113025019-A High-heat-resistance flame-retardant polycarbonate composite material and preparation method thereof 上海杰事杰新材料(集团)股份有限公司 2021-06-25 CN disclosed
CN-113025019-A High-heat-resistance flame-retardant polycarbonate composite material and preparation method thereof 上海杰事杰新材料(集团)股份有限公司 2021-06-25 CN disclosed
US-20130237644-A1 COPIER/PRINTER EXTERIOR PART USING HALOGEN-FREE FLAME-RETARDANT RESIN COMPOSITION INCLUDING RECYCLED POLYCARBONATE AND RECYCLED POLYETHYLENE TEREPHTHALATE KONICA MINOLTA BUSINESS TECHNOLOGIES, INC. (JP) 2013-09-12 US disclosed
EP-2617767-A1 Copier/printer exerior part using halogen-free flame-retardant resin composition including recycled polycarbonate and recycled polyethylene terephthalate Konica Minolta Business Technologies, Inc. (JP) 2013-07-24 EP disclosed
US-8013052-B2 Curable resin, production method thereof, epoxy resin composition, and electronic device HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-09-06 US disclosed
US-7585904-B2 Curing accelerator comprising a reaction product of an intramolecular phosphonium salt and a silanol compound; suitable as a material for laminates and adhesives and an electronic parts device comprising an element that has been encapsulated using such a curable resin composition HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-09-08 US disclosed
US-20090023855-A1 NOVEL CURABLE RESIN, PRODUCTION METHOD THEREOF, EPOXY RESIN COMPOSITION, AND ELECTRONIC DEVICE RESONAC CORPORATION (JP) 2009-01-22 US disclosed
US-20090012232-A1 Curing accelerator comprising a reaction product of an intramolecular phosphonium salt and a silanol compound; suitable as a material for laminates and adhesives and an electronic parts device comprising an element that has been encapsulated using such a curable resin composition HITACHI CHEMICAL CO., LTD. (JP) 2009-01-08 US disclosed
WO-1988008309-A1 COMPOSITIONS FOR TREATING CONTACT LENSES UNIVERSITY OF BATH (GB) 1988-11-03 WO disclosed