SCHEMBL2467380

SCHEMBL2467380

BrC=C(Br)C(Br)OC(Br)C(Br)=CBr

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16970390 0.67
SCHEMBL8559984 0.61
SCHEMBL11850404 0.60
SCHEMBL11850397 0.60
SCHEMBL15302447 0.56
SCHEMBL523710 0.53
SCHEMBL2549391 0.52 ALDH1A1 (0.32)
SCHEMBL2902581 0.50
SCHEMBL16970096 0.50
SCHEMBL4816764 0.50

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2371877-B1 POLYCARBONATE RESIN, POLYCARBONATE RESIN COMPOSITION, OPTICAL FILM, AND POLYCARBONATE RESIN MOLDED ARTICLE MITSUBISHI CHEM CORP (JP) 2026-04-29 EP disclosed
EP-2554599-B2 POLYCARBONATE RESIN COMPOSITION, METHOD FOR PRODUCING SAME AND MOLDED ARTICLE OF THIS RESIN COMPOSITION MITSUBISHI CHEM CORP (JP) 2024-08-28 EP disclosed
CN-114641534-B Resin composition and electronic and electrical device component 三菱化学株式会社 2024-02-20 CN disclosed
US-20220363894-A1 RESIN COMPOSITION AND ELECTRONIC/ELECTRIC EQUIPMENT COMPONENT MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2022-11-17 US disclosed
EP-4056623-A1 RESIN COMPOSITION AND ELECTRONIC/ELECTRICAL DEVICE COMPONENT Mitsubishi Engineering-Plastics Corporation (JP) 2022-09-14 EP disclosed
CN-114641534-A Resin composition and electronic and electrical device member 三菱工程塑料株式会社 2022-06-17 CN disclosed
EP-2557123-B1 POLYCARBONATE RESIN COMPOSITION, METHOD FOR PRODUCING SAME AND MOLDED ARTICLE OF THIS RESIN COMPOSITION MITSUBISHI CHEM CORP (JP) 2020-04-29 EP disclosed
EP-2677002-B1 POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE MITSUBISHI CHEM CORP (JP) 2019-03-27 EP disclosed
EP-2789640-B1 POLYCARBONATE RESINS, POLYCARBONATE RESIN COMPOSITIONS, OPTICAL FILM, AND POLYCARBONATE RESIN MOLDED ARTICLES MITSUBISHI CHEM CORP (JP) 2019-01-02 EP disclosed
EP-2832764-B1 POLYCARBONATE RESIN, POLYCARBONATE RESIN COMPOSITION, AND MOLDED ARTICLE THEREOF MITSUBISHI CHEM CORP (JP) 2018-01-10 EP disclosed
US-20130030113-A1 POLYCARBONATE RESIN COMPOSITION, METHOD FOR PRODUCING SAME AND MOLDED ARTICLE OF THIS RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 2013-01-31 US disclosed
US-20130030112-A1 POLYCARBONATE RESIN COMPOSITION, METHOD FOR PRODUCING SAME AND MOLDED ARTICLE OF THIS RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 2013-01-31 US disclosed
EP-2371877-A1 POLYCARBONATE RESIN, POLYCARBONATE RESIN COMPOSITION, OPTICAL FILM, AND POLYCARBONATE RESIN MOLDED ARTICLE Mitsubishi Chemical Corporation (JP) 2011-10-05 EP disclosed
US-7498283-B2 Glass powder and resin composition comprising it ASAHI FIBER GLASS COMPANY, LIMITED (JP) 2009-03-03 US disclosed
EP-1621575-B1 Glass powder and resin composition comprising it ASAHI FIBREGLASS CO (JP) 2008-09-03 EP disclosed
US-20060025513-A1 Glass powder and resin composition comprising it ASAHI FIBER GLASS COMPANY, LIMITED (JP) 2006-02-02 US disclosed
EP-1621575-A1 Glass powder and resin composition comprising it Asahi Fiber Glass Company, Limited (JP) 2006-02-01 EP disclosed
EP-0042440-B1 FIRE RETARDANT ORGANIC HIGH MOLECULAR COMPOSITION ACOME, SOCIETE COOPERATIVE DE TRAVAILLEURS (FR) 1985-03-27 EP disclosed
US-4410648-A CYCLIC ANHYDRIDE OR IMIDE, INORGANIC POWDER, POLYUNSATURATED MONOMER DAINICHI-NIPPON CABLES, LTD. (JP) 1983-10-18 US disclosed
EP-0042440-A1 FIRE RETARDANT ORGANIC HIGH MOLECULAR COMPOSITION ACOME, SOCIETE COOPERATIVE DE TRAVAILLEURS (FR) 1981-12-30 EP disclosed