Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CES2 | O00748 | 3/20 | 0.42 |
| ▸ | CES1 | P23141 | 3/20 | 0.42 |
| ▸ | ASAH1 | Q13510 | 2/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.41 |
| ▸ | ACER2 | Q5QJU3 | 1/20 | 0.41 |
| ▸ | HPGD | P15428 | 1/20 | 0.37 |
| ▸ | CERT1 | Q9Y5P4 | 3/20 | 0.36 |
| ▸ | NAAA | Q02083 | 2/20 | 0.36 |
| ▸ | NPC1 | O15118 | 2/20 | 0.35 |
| ▸ | RAB9A | P51151 | 2/20 | 0.35 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.35 |
| ▸ | LMNA | P02545 | 2/20 | 0.34 |
| ▸ | PAX8 | Q06710 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18488271 | 1.00 | CES2 (0.42) | CES2CES1ASAH1ALDH1A1ACER2 | |
| SCHEMBL91994 | 0.82 | CES2 (0.46) | CES2CES1ALDH1A1HPGD | |
| SCHEMBL16279115 | 0.82 | CES2 (0.46) | CES2CES1ALDH1A1HPGD | |
| SCHEMBL16279116 | 0.82 | CES2 (0.46) | CES2CES1ALDH1A1HPGD | |
| SCHEMBL13478325 | 0.82 | CES2 (0.43) | CES2CES1ASAH1ALDH1A1ACER2 | |
| SCHEMBL22729193 | 0.81 | CES2 (0.48) | CES2CES1ALDH1A1HPGDNPC1 | |
| SCHEMBL13478308 | 0.81 | CES2 (0.45) | CES2CES1ALDH1A1HPGDNPC1 | |
| SCHEMBL13478312 | 0.81 | CES2 (0.45) | CES2CES1ALDH1A1HPGDNPC1 | |
| SCHEMBL103376 | 0.81 | CES2 (0.48) | CES2CES1ALDH1A1HPGDNPC1 | |
| SCHEMBL12021972 | 0.81 | CES2 (0.48) | CES2CES1ALDH1A1HPGDNPC1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20220276555-A1 | Photosensitive Resin Composition, Method Of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, And Electronic Component | HD MICROSYSTEMS, LTD. (JP) | 2022-09-01 | — | — | US | disclosed |