SCHEMBL2471032

SCHEMBL2471032

O[Si](O)(O)O.[AlH3].[P]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8840187 0.93
SCHEMBL8503534 0.91
SCHEMBL12470801 0.91
SCHEMBL33512 0.91
SCHEMBL11356950 0.91
SCHEMBL2400500 0.91
SCHEMBL21457927 0.91
SCHEMBL17263 0.91
SCHEMBL23716983 0.83
SCHEMBL1369435 0.83

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1782474-B1 HIGH STRAIN GLASS/GLASS-CERAMIC CONTAINING SEMICONDUCTOR-ON-INSULATOR STRUCTURES CORNING INC (US) 2013-11-27 EP claimed
EP-1782472-A4 STRAINED SEMICONDUCTOR-ON-INSULATOR STRUCTURES AND METHODS FOR MAKING STRAINED SEMICONDUCTOR-ON-INSULATOR STRUCTURES CORNING INC (US) 2009-08-12 EP claimed
US-7473969-B2 High strain glass/glass-ceramic containing semiconductor-on-insulator structures CORNING INCORPORATED (US) 2009-01-06 US claimed
US-7262466-B2 Strained semiconductor-on-insulator structures and methods for making strained semiconductor-on-insulator structures CORNING INCORPORATED (US) 2007-08-28 US claimed
EP-1782474-A2 HIGH STRAIN GLASS/GLASS-CERAMIC CONTAINING SEMICONDUCTOR-ON-INSULATOR STRUCTURES Corning Incorporated (US) 2007-05-09 EP claimed
EP-1782472-A2 STRAINED SEMICONDUCTOR-ON-INSULATOR STRUCTURES AND METHODS FOR MAKING STRAINED SEMICONDUCTOR-ON-INSULATOR STRUCTURES Corning Incorporated (US) 2007-05-09 EP claimed
WO-2006023594-A2 HIGH STRAIN GLASS/GLASS-CERAMIC CONTAINING SEMICONDUCTOR-ON-INSULATOR STRUCTURES CORNING INCORPORATED (US) 2006-03-02 WO claimed
WO-2006023289-A2 STRAINED SEMICONDUCTOR-ON-INSULATOR STRUCTURES AND METHODS FOR MAKING STRAINED SEMICONDUCTOR-ON-INSULATOR STRUCTURES CORNING INCORPORATED (US) 2006-03-02 WO claimed
US-20060038228-A1 High strain glass/glass-ceramic containing semiconductor-on-insulator structures CORNING INCORPORATED 2006-02-23 US claimed
US-20060038227-A1 Strained semiconductor-on-insulator structures and methods for making strained semiconductor-on-insulator structures CORNING INCORPORATED 2006-02-23 US claimed
CN-118145840-A Fishing light pollution complementary marine product culture system and method thereof 皓禹(厦门)环保有限公司 2024-06-07 CN disclosed
EP-1782474-B1 HIGH STRAIN GLASS/GLASS-CERAMIC CONTAINING SEMICONDUCTOR-ON-INSULATOR STRUCTURES CORNING INC (US) 2013-11-27 EP disclosed
EP-1782472-B1 STRAINED SEMICONDUCTOR-ON-INSULATOR STRUCTURES AND METHODS FOR MAKING STRAINED SEMICONDUCTOR-ON-INSULATOR STRUCTURES CORNING INC (US) 2011-10-05 EP disclosed
CN-101091251-B Semiconductor-on-insulator structures containing high strain glass/glass-ceramic CORNING INC 2011-03-16 CN disclosed
EP-1782472-A4 STRAINED SEMICONDUCTOR-ON-INSULATOR STRUCTURES AND METHODS FOR MAKING STRAINED SEMICONDUCTOR-ON-INSULATOR STRUCTURES CORNING INC (US) 2009-08-12 EP disclosed
EP-1782474-A2 HIGH STRAIN GLASS/GLASS-CERAMIC CONTAINING SEMICONDUCTOR-ON-INSULATOR STRUCTURES Corning Incorporated (US) 2007-05-09 EP disclosed
WO-2006023289-A2 STRAINED SEMICONDUCTOR-ON-INSULATOR STRUCTURES AND METHODS FOR MAKING STRAINED SEMICONDUCTOR-ON-INSULATOR STRUCTURES CORNING INCORPORATED (US) 2006-03-02 WO disclosed
WO-2006023594-A2 HIGH STRAIN GLASS/GLASS-CERAMIC CONTAINING SEMICONDUCTOR-ON-INSULATOR STRUCTURES CORNING INCORPORATED (US) 2006-03-02 WO disclosed
US-20060038228-A1 High strain glass/glass-ceramic containing semiconductor-on-insulator structures CORNING INCORPORATED 2006-02-23 US disclosed
US-20060038227-A1 Strained semiconductor-on-insulator structures and methods for making strained semiconductor-on-insulator structures CORNING INCORPORATED 2006-02-23 US disclosed