⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4366429 | 0.97 | — | — | |
| SCHEMBL17330299 | 0.94 | — | — | |
| SCHEMBL3956499 | 0.88 | — | — | |
| SCHEMBL17330294 | 0.78 | — | — | |
| SCHEMBL2864111 | 0.78 | — | — | |
| SCHEMBL20942813 | 0.76 | — | — | |
| SCHEMBL2866867 | 0.76 | — | — | |
| SCHEMBL2855268 | 0.75 | — | — | |
| SCHEMBL17498472 | 0.74 | ADRB2 (0.35) | — | |
| SCHEMBL15157466 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 89 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109942619-B | Synthesis method of 1-methyl-1-ethoxy-silacyclopentane | 山东东岳有机硅材料股份有限公司 | 2021-08-10 | — | — | CN | claimed |
| EP-2993687-B1 | METHOD FOR PROVIDING PORE SEALING LAYER ON POROUS LOW DIELECTRIC CONSTANT FILMS | VERSUM MAT US LLC (US) | 2020-02-05 | — | — | EP | claimed |
| US-10395920-B2 | Alkyl-alkoxysilacyclic compounds | VERSUM MATERIALS US, LLC (US) | 2019-08-27 | — | — | US | claimed |
| US-20180277360-A1 | Method and Composition for Providing Pore Sealing Layer on Porous Low Dielectric Constant Films | VERSUM MATERIALS US, LLC (US) | 2018-09-27 | — | — | US | claimed |
| EP-3358602-A1 | ALKYL-ALKOXYSILACYCLIC COMPOUNDS AND METHODS FOR DEPOSITING FILMS USING SAME | Versum Materials US, LLC (US) | 2018-08-08 | — | — | EP | claimed |
| EP-2958135-B1 | METHODS FOR DEPOSITING FILMS USING ALKYL-ALKOXYSILACYCLIC COMPOUNDS | VERSUM MAT US LLC (US) | 2018-03-28 | — | — | EP | claimed |
| US-9922818-B2 | Alkyl-alkoxysilacyclic compounds | VERSUM MATERIALS US, LLC (US) | 2018-03-20 | — | — | US | claimed |
| EP-2993687-A1 | METHOD AND COMPOSITION FOR PROVIDING PORE SEALING LAYER ON POROUS LOW DIELECTRIC CONSTANT FILMS | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2016-03-09 | — | — | EP | claimed |
| US-20160049293-A1 | METHOD AND COMPOSITION FOR PROVIDING PORE SEALING LAYER ON POROUS LOW DIELECTRIC CONSTANT FILMS | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2016-02-18 | — | — | US | claimed |
| EP-2958135-A1 | ALKYL-ALKOXYSILACYCLIC COMPOUNDS AND METHODS FOR DEPOSITING FILMS USING SAME | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2015-12-23 | — | — | EP | claimed |
| US-20150364321-A1 | Alkyl-Alkoxysilacyclic Compounds and Methods for Depositing Films Using Same | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2015-12-17 | — | — | US | claimed |
| US-7500397-B2 | Activated chemical process for enhancing material properties of dielectric films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2009-03-10 | — | — | US | claimed |
| US-20080199977-A1 | Activated Chemical Process for Enhancing Material Properties of Dielectric Films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2008-08-21 | — | — | US | claimed |
| EP-1959485-A2 | Activated chemical process for enhancing material properties of dielectric films | Air Products and Chemicals, Inc. (US) | 2008-08-20 | — | — | EP | claimed |
| US-20260107711-A1 | PRECURSORS FOR DEPOSITING FILMS WITH ELASTIC MODULUS | VERSUM MAT US LLC (US) | 2026-04-16 | — | — | US | disclosed |
| US-12563982-B2 | Additives to enhance the properties of dielectric films | VERSUM MATERIALS US, LLC (US) | 2026-02-24 | — | — | US | disclosed |
| EP-4110969-B1 | NEW PRECURSORS FOR DEPOSITING FILMS WITH HIGH ELASTIC MODULUS | VERSUM MAT US LLC (US) | 2025-12-10 | — | — | EP | disclosed |
| US-7500397-B2 | Activated chemical process for enhancing material properties of dielectric films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2009-03-10 | — | — | US | disclosed |
| US-20080199977-A1 | Activated Chemical Process for Enhancing Material Properties of Dielectric Films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2008-08-21 | — | — | US | disclosed |
| EP-1959485-A2 | Activated chemical process for enhancing material properties of dielectric films | Air Products and Chemicals, Inc. (US) | 2008-08-20 | — | — | EP | disclosed |