SCHEMBL2483891

SCHEMBL2483891

CCCCCCCCC(=O)N(C)CCCCCCC

nearest known ligand 0.70

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
EPHX2 P34913 5/20 0.70
KDM5A P29375 7/20 0.54
KDM4C Q9H3R0 7/20 0.54
PHF8 Q9UPP1 4/20 0.54
ALDH1A1 P00352 1/20 0.52
KDM5C P41229 1/20 0.51
KDM5B Q9UGL1 1/20 0.51
CNR1 P21554 1/20 0.51
BCHE P06276 1/20 0.51
ACHE P22303 1/20 0.51
CES2 O00748 3/20 0.50
CES1 P23141 3/20 0.50
KDM4A O75164 2/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11777140 1.00 EPHX2 (0.70) EPHX2KDM5AKDM4CPHF8ALDH1A1
SCHEMBL11702777 1.00 EPHX2 (0.70) EPHX2KDM5AKDM4CPHF8ALDH1A1
SCHEMBL2482309 1.00 EPHX2 (0.70) EPHX2KDM5AKDM4CPHF8ALDH1A1
SCHEMBL5293678 1.00 EPHX2 (0.70) EPHX2KDM5AKDM4CPHF8ALDH1A1
SCHEMBL2484953 1.00 EPHX2 (0.70) EPHX2KDM5AKDM4CPHF8ALDH1A1
SCHEMBL23343387 1.00 EPHX2 (0.70) EPHX2KDM5AKDM4CPHF8ALDH1A1
SCHEMBL5284897 1.00 EPHX2 (0.70) EPHX2KDM5AKDM4CPHF8ALDH1A1
SCHEMBL11775303 1.00 EPHX2 (0.70) EPHX2KDM5AKDM4CPHF8ALDH1A1
SCHEMBL21596652 1.00 EPHX2 (0.70) EPHX2KDM5AKDM4CPHF8ALDH1A1
SCHEMBL28514548 1.00 EPHX2 (0.70) EPHX2KDM5AKDM4CPHF8ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024009541-A1 METHOD FOR PRODUCING WATER-ABSORBING RESIN COMPOSITION SDPグローバル株式会社 2024-01-11 WO disclosed
CN-110475610-B Absorbent article 三大雅株式会社 2023-03-17 CN disclosed
CN-111094441-B Water-absorbent resin composition and method for producing same 三大雅株式会社 2022-02-01 CN disclosed
US-8742023-B2 Absorbent resin particle, process for producing the same, absorber containing the same, and absorbent article SAN-DIA POLYMERS, LTD. (JP) 2014-06-03 US disclosed
EP-2377897-B1 ABSORBING RESIN PARTICLES, PROCESS FOR PRODUCING SAME, AND ABSORBENT AND ABSORBING ARTICLE BOTH INCLUDING SAME SAN DIA POLYMERS LTD (JP) 2014-04-23 EP disclosed
US-20110301560-A1 ABSORBENT RESIN PARTICLE, PROCESS FOR PRODUCING THE SAME, ABSORBER CONTAINING THE SAME, AND ABSORBENT ARTICLE SAN-DIA POLYMERS, LTD. (JP) 2011-12-08 US disclosed
EP-2377897-A1 ABSORBING RESIN PARTICLES, PROCESS FOR PRODUCING SAME, AND ABSORBENT AND ABSORBING ARTICLE BOTH INCLUDING SAME San-Dia Polymers, Ltd. (JP) 2011-10-19 EP disclosed