Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 1/20 | 0.67 |
| ▸ | TSHR | P16473 | 1/20 | 0.67 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.67 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Boric Acid SCHEMBL2484092 | 1.00 | — | — | |
| Boric Acid SCHEMBL9396746 | 1.00 | LMNA (0.67) | LMNATSHRTDP1 | |
| Boric Acid SCHEMBL10525257 | 0.93 | — | — | |
| Boric Acid SCHEMBL10351607 | 0.93 | — | — | |
| Boric Acid SCHEMBL133617 | 0.91 | LMNA (0.80) | LMNATSHRTDP1 | |
| Boric Acid SCHEMBL18262783 | 0.91 | LMNA (0.80) | LMNATSHRTDP1 | |
| Boric Acid SCHEMBL26972 | 0.91 | — | — | |
| Boric Acid SCHEMBL9133168 | 0.91 | LMNA (0.80) | LMNATSHRTDP1 | |
| Boric Acid SCHEMBL524549 | 0.91 | LMNA (0.80) | LMNATSHRTDP1 | |
| Boric Acid SCHEMBL4925409 | 0.91 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-203719813-U | SOI absolute pressure sensitive device employing no-leading-wire packaging structure | CN ELECT TECH NO 49 RES INST | 2014-07-16 | — | — | CN | claimed |
| CN-103759880-A | Leadless packaging structure and SOI absolute pressure sensitive device of leadless packaging structure | CN ELECT TECH NO 49 RES INST | 2014-04-30 | — | — | CN | claimed |
| CN-1283277-A | Optical device and fusion sealing agent | CORNING INC (US) | 2001-02-07 | — | — | CN | claimed |
| CN-1065876-A | ENCAPULANT COMPOSITION | DU PONT (US) | 1992-11-04 | — | — | CN | claimed |
| CN-87107196-A | With ceramics-glass-metal composite encapsulating electronic components | — | 1988-08-31 | — | — | CN | claimed |
| CN-103759880-B | A kind of SOI absolute pressure Sensitive Apparatus adopting leadless packaging structure | THE 49TH RESEARCH INSTITUTE OF CECT (CN) | 2016-03-02 | — | — | CN | disclosed |
| CN-103940536-B | A kind of pressure-sensitive component adopting ceramet shell axially to sinter | THE 49TH RESEARCH INSTITUTE OF CECT (CN) | 2016-03-02 | — | — | CN | disclosed |
| CN-203858052-U | Pressure sensitive component adopting ceramic metal tube shell axial sintering | CHINA ELECTRONICS TECHNOLOGY GROUP CORP NO 49 RES | 2014-10-01 | — | — | CN | disclosed |
| CN-103940536-A | Pressure-sensitive device with axial sintering of ceramic metal tube shell adopted | CN ELECT TECH NO 49 RES INST | 2014-07-23 | — | — | CN | disclosed |
| CN-203719813-U | SOI absolute pressure sensitive device employing no-leading-wire packaging structure | CN ELECT TECH NO 49 RES INST | 2014-07-16 | — | — | CN | disclosed |
| CN-103759880-A | Leadless packaging structure and SOI absolute pressure sensitive device of leadless packaging structure | CN ELECT TECH NO 49 RES INST | 2014-04-30 | — | — | CN | disclosed |
| EP-1786250-B1 | Composite wiring board and manufacturing method thereof | TDK CORP (JP) | 2011-10-19 | — | — | EP | disclosed |
| CN-1856216-A | Multilayer ceramic substrate and production method thereof | TDK CORP (JP) | 2006-11-01 | — | — | CN | disclosed |
| CN-1564953-A | Glass bonded fiber array and method for the fabrication thereof | SHIPLEY CO LLC (US) | 2005-01-12 | — | — | CN | disclosed |
| CN-1283277-A | Optical device and fusion sealing agent | CORNING INC (US) | 2001-02-07 | — | — | CN | disclosed |
| CN-1056461-C | Ceramic capacitor | MURATA MANUFACTURING CO (JP) | 2000-09-13 | — | — | CN | disclosed |
| CN-1196491-A | Optical device and fusion seal | CORNING INC (US) | 1998-10-21 | — | — | CN | disclosed |
| CN-1126360-A | Ceramic capacitor | MURATA MANUFACTURING CO (JP) | 1996-07-10 | — | — | CN | disclosed |
| CN-1065876-A | ENCAPULANT COMPOSITION | DU PONT (US) | 1992-11-04 | — | — | CN | disclosed |
| CN-87107196-A | With ceramics-glass-metal composite encapsulating electronic components | — | 1988-08-31 | — | — | CN | disclosed |