SCHEMBL2485054

SCHEMBL2485054

CC(C)(C)N=CNC(C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10057928 1.00
SCHEMBL19375746 0.71
SCHEMBL20202895 0.69
SCHEMBL19624067 0.65
SCHEMBL16573556 0.63
SCHEMBL11173350 0.61
SCHEMBL4969030 0.60
SCHEMBL241691 0.60
SCHEMBL985476 0.60
SCHEMBL4549129 0.60

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117096019-A Methods and systems for forming memory devices and components thereof ASM IP私人控股有限公司 2023-11-21 CN claimed
CN-118553731-A Memory devices, components thereof, and related methods and systems ASM IP私人控股有限公司 2024-08-27 CN disclosed
CN-117096019-A Methods and systems for forming memory devices and components thereof ASM IP私人控股有限公司 2023-11-21 CN disclosed
US-10600643-B2 Method of forming thin film and method of manufacturing integrated circuit device using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2020-03-24 US disclosed
US-20180342391-A1 METHOD OF FORMING THIN FILM AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2018-11-29 US disclosed
EP-1921061-B1 METAL-CONTAINING COMPOUND, PROCESS FOR PRODUCING THE SAME AND METHOD OF FORMING A METAL-CONTAINING THIN FILM TOSOH CORP (JP) 2011-10-19 EP disclosed
US-7816549-B2 Metal-containing compound, its production method, metal-containing thin film, and its formation method TOSOH CORPORATION (JP) 2010-10-19 US disclosed
US-20100105936-A1 reaction of dialkylamino metal compound with a dialkylamidine; complex of tetrakis(dimethylamido)titanium and N,N'-diisopropylacetamidine; semiconductor; thermal stability; moderate vaporizability; liquid; stable to water; CVD or ALD atomic layer deposition; oxide of Al, Ga, Hafnium, indium, or titanium TOSOH CORPORATION (JP) 2010-04-29 US disclosed
US-7396949-B2 Class of volatile compounds for the deposition of thin films of metals and metal compounds PRESIDENT AND FELLOWS OF HARVARD COLLEGE 2008-07-08 US disclosed
EP-1921061-A1 METAL-CONTAINING COMPOUND, PROCESS FOR PRODUCING THE SAME, METAL-CONTAINING THIN FILM, AND METHOD OF FORMING THE SAME Tosoh Corporation (JP) 2008-05-14 EP disclosed
US-20050042372-A1 Class of volatile compounds for the deposition of thin films of metals and metal compounds PRESIDENT AND FELLOWS OF HARVARD COLLEGE 2005-02-24 US disclosed