SCHEMBL2487559

SCHEMBL2487559

CC(C)(CN)CCN

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6904082 0.94 CYP2D6 (0.53)
SCHEMBL1956399 0.85
SCHEMBL5432822 0.85 CYP2D6 (0.69)
SCHEMBL936164 0.84 CYP2D6 (0.50)
SCHEMBL10586157 0.82 CYP2D6 (0.41)
SCHEMBL296447 0.80
SCHEMBL524335 0.79 CYP2D6 (0.60)
SCHEMBL16312486 0.79 CYP2D6 (0.41)
SCHEMBL831341 0.78 CYP2D6 (0.50)
SCHEMBL42682 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 99 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240425723-A1 PAD-IN-A-BOTTLE CHEMICAL MECHANICAL PLANARIZATION POLISHING WITH COST-EFFECTIVE NON-POROUS SOLID POLISHING PADS VERSUM MATERIALS US, LLC 2024-12-26 US claimed
US-20240352279-A1 PAD-IN-A-BOTTLE (PIB) TECHNOLOGY FOR COPPER BARRIER SLURRIES VERSUM MATERIALS US, LLC 2024-10-24 US claimed
CN-118318015-A In-bottle Pad (PIB) chemical mechanical planarization polishing using economical non-porous solid polishing pads 弗萨姆材料美国有限责任公司 2024-07-09 CN claimed
EP-4373897-A1 PAD-IN-A-BOTTLE (PIB) TECHNOLOGY FOR COPPER BARRIER SLURRIES Versum Materials US, LLC (US) 2024-05-29 EP claimed
CN-117916332-A Pad In Bottle (PIB) technology for copper barrier slurries 弗萨姆材料美国有限责任公司 2024-04-19 CN claimed
US-20230287242-A1 PAD-IN-A-BOTTLE (PIB) TECHNOLOGY FOR COPPER AND THROUGH-SILICON VIA (TSV) CHEMICAL-MECHANICAL PLANARIZATION (CMP) VERSUM MATERIALS US, LLC 2023-09-14 US claimed
CN-116249754-A Pad-in-bottle (PIB) technique for Chemical Mechanical Planarization (CMP) of copper and Through Silicon Vias (TSVs) 弗萨姆材料美国有限责任公司 2023-06-09 CN claimed
EP-4189026-A1 PAD-IN-A-BOTTLE (PIB) TECHNOLOGY FOR COPPER AND THROUGH-SILICON VIA (TSV) CHEMICAL-MECHANICAL PLANARIZATION (CMP) Versum Materials US, LLC (US) 2023-06-07 EP claimed
WO-2023004269-A1 PAD-IN-A-BOTTLE (PIB) TECHNOLOGY FOR COPPER BARRIER SLURRIES VERSUM MATERIALS US, LLC (US) 2023-01-26 WO claimed
WO-2022026369-A1 PAD-IN-A-BOTTLE (PIB) TECHNOLOGY FOR COPPER AND THROUGH-SILICON VIA (TSV) CHEMICAL-MECHANICAL PLANARIZATION (CMP) VERSUM MATERIALS US, LLC (US) 2022-02-03 WO claimed
CN-111732897-A Chemical mechanical polishing for copper and through silicon via applications 弗萨姆材料美国有限责任公司 2020-10-02 CN claimed
US-20200277514-A1 Chemical Mechanical Polishing For Copper And Through Silicon Via Applications VERSUM MATERIALS US, LLC (US) 2020-09-03 US claimed
EP-3702425-A1 CHEMICAL MECHANICAL POLISHING FOR COPPER AND THROUGH SILICON VIA APPLICATIONS Versum Materials US, LLC (US) 2020-09-02 EP claimed
US-20250014911-A1 PAD-IN-A-BOTTLE AND SINGLE PLATEN CHEMICAL MECHANICAL-PLANARIZATION FOR BACK-END APPLICATIONS VERSUM MATERIALS US, LLC 2025-01-09 US disclosed
US-20240425723-A1 PAD-IN-A-BOTTLE CHEMICAL MECHANICAL PLANARIZATION POLISHING WITH COST-EFFECTIVE NON-POROUS SOLID POLISHING PADS VERSUM MATERIALS US, LLC 2024-12-26 US disclosed
US-20240352279-A1 PAD-IN-A-BOTTLE (PIB) TECHNOLOGY FOR COPPER BARRIER SLURRIES VERSUM MATERIALS US, LLC 2024-10-24 US disclosed
EP-0219936-A1 Novel platinum complexes Nippon Kayaku Kabushiki Kaisha (JP) 1987-04-29 EP disclosed
CN-86105441-A Novel platinum complex production method 1987-03-11 CN disclosed
EP-0167887-A1 Process for the preparation of N-substituted aminoalkylsilanes UNION CARBIDE CORPORATION (US) 1986-01-15 EP disclosed
US-4526996-A Reacting primary or secondary amine with cyanoalkylsilane in the presence of rhodium, platinum, palladium hydrogenation catalyst UNION CARBIDE CORPORATION (US) 1985-07-02 US disclosed