Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2487559 | 0.94 | — | — | |
| SCHEMBL1956399 | 0.87 | — | — | |
| SCHEMBL5432822 | 0.87 | CYP2D6 (0.69) | CYP2D6KDM4E | |
| SCHEMBL10586157 | 0.82 | CYP2D6 (0.41) | CYP2D6 | |
| SCHEMBL24741007 | 0.81 | CYP2D6 (0.37) | CYP2D6 | |
| SCHEMBL936164 | 0.79 | CYP2D6 (0.50) | CYP2D6KDM4E | |
| SCHEMBL14456599 | 0.78 | CYP2D6 (0.56) | CYP2D6KDM4E | |
| SCHEMBL24053161 | 0.77 | CYP2D6 (0.33) | CYP2D6 | |
| SCHEMBL19889867 | 0.75 | CYP2D6 (0.53) | CYP2D6KDM4E | |
| SCHEMBL296447 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4663374-A1 | POLYAMIDE RESIN COMPOSITION FOR INSERT MOLDING, METAL RESIN COMPOSITE BODY AND METHOD FOR PRODUCING SAME | Mitsui Chemicals, Inc. (JP) | 2025-12-17 | — | — | EP | disclosed |
| EP-4663703-A1 | POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE | Mitsui Chemicals, Inc. (JP) | 2025-12-17 | — | — | EP | disclosed |
| EP-4582484-A1 | POLYAMIDE RESIN COMPOSITION, METAL/RESIN JOINED BODY AND METHOD FOR PRODUCING SAME, BUS BAR UNIT, DRIVE UNIT, AND MOBILE OBJECT | Mitsui Chemicals, Inc. (JP) | 2025-07-09 | — | — | EP | disclosed |
| WO-2025084296-A1 | POLYAMIDE RESIN COMPOSITION AND MOLDED OBJECT | 三井化学株式会社 | 2025-04-24 | — | — | WO | disclosed |
| WO-2024166903-A1 | POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE | 三井化学株式会社 | 2024-08-15 | — | — | WO | disclosed |
| WO-2024048508-A1 | POLYAMIDE RESIN COMPOSITION, METAL/RESIN JOINED BODY AND METHOD FOR PRODUCING SAME, BUS BAR UNIT, DRIVE UNIT, AND MOBILE OBJECT | 三井化学株式会社 | 2024-03-07 | — | — | WO | disclosed |
| EP-4130140-A1 | SEMI-AROMATIC POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLES THEREFROM | Mitsui Chemicals, Inc. (JP) | 2023-02-08 | — | — | EP | disclosed |
| EP-0864610-B1 | Semiaromatic polyamide resin composition | MITSUI CHEMICALS INC (JP) | 2004-01-21 | — | — | EP | disclosed |
| US-6319986-B1 | BLEND OF COPOLYAMIDE FROM TEREPHTHALIC ACID AND MIXTURE OF STRAIGHT-CHAIN AND BRANCH-CHAIN ALKYLENEDIAMINES; COPOLYAMIDE OF DODECANOLACTAM AND DODECANEDIOIC ACID AND DIAMINE; AND GRAFTED OLEFIN COPOLYMER | MITSUI CHEMICALS (JP) | 2001-11-20 | — | — | US | disclosed |
| US-6117942-A | GRAFT-MODIFIED ETHYLENE-ALPHA OLEFIN COPOLYMER, A POLYTEREPHTHALAMIDE EXHIBITS EXCELLENT ANTI-CREEPING PROPERTY UNDER HIGH-TEMPERATURE AND HIGH-HUMIDITY CONDITIONS, MOLDING MATERIAL | MITSUI CHEMICALS (JP) | 2000-09-12 | — | — | US | disclosed |
| EP-0864610-A1 | Semiaromatic polyamide resin composition | Mitsui Chemicals, Inc. (JP) | 1998-09-16 | — | — | EP | disclosed |