SCHEMBL2489132

SCHEMBL2489132

COC(=O)/C=C\C#N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2243992 1.00
SCHEMBL35480 1.00
SCHEMBL7585288 0.91 HCAR2 (0.60)
Hydroquinone SCHEMBL10656389 0.85 CA12 (0.59)
SCHEMBL11399328 0.83 NFE2L2 (0.52)
Dimethyl Maleate SCHEMBL11571389 0.80 NFE2L2 (0.62)
Dimethyl Fumarate SCHEMBL11571392 0.80 NFE2L2 (0.62)
Dimethyl Fumarate SCHEMBL29070198 0.80 NFE2L2 (0.93)
SCHEMBL10934798 0.80 HCAR2 (0.42)
SCHEMBL10934801 0.80 HCAR2 (0.42)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 73 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1629549-B1 METHOD OF PRODUCING MEMBRANE ELECTRODE ASSEMBLIES FOR USE IN PROTON EXCHANGE MEMBRANE CABOT CORP (US) 2011-10-26 EP disclosed
US-7732002-B2 Method for the fabrication of conductive electronic features CABOT CORPORATION (US) 2010-06-08 US disclosed
US-7713899-B2 Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells CABOT CORPORATION (US) 2010-05-11 US disclosed
US-20100112195-A1 METHOD FOR THE FABRICATION OF CONDUCTIVE ELECTRONIC FEATURES CABOT CORPORATION 2010-05-06 US disclosed
US-7691664-B2 Low viscosity precursor compositions and methods for the deposition of conductive electronic features CABOT CORPORATION (US) 2010-04-06 US disclosed
US-20100034986-A1 Low viscosity precursor compositions and methods for the deposition of conductive electronic features CABOT CORPORATION (US) 2010-02-11 US disclosed
US-7642213-B2 Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells CABOT CORPORATION (US) 2010-01-05 US disclosed
US-7629017-B2 Methods for the deposition of conductive electronic features CABOT CORPORATION (US) 2009-12-08 US disclosed
US-7553512-B2 Method for fabricating an inorganic resistor CABOT CORPORATION (US) 2009-06-30 US disclosed
US-7524528-B2 Precursor compositions and methods for the deposition of passive electrical components on a substrate CABOT CORPORATION (US) 2009-04-28 US disclosed
EP-1444055-A1 TAPE COMPOSITIONS FOR THE DEPOSITION OF ELECTRONIC FEATURES Superior Micropowders LLC (US) 2004-08-11 EP disclosed
US-20040038808-A1 Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells CABOT CORPORATION 2004-02-26 US disclosed
US-20030180451-A1 Low viscosity copper precursor compositions and methods for the deposition of conductive electronic features CABOT CORPORATION 2003-09-25 US disclosed
US-20030175411-A1 Precursor compositions and methods for the deposition of passive electrical components on a substrate CABOT CORPORATION 2003-09-18 US disclosed
US-20030161959-A1 Precursor compositions for the deposition of passive electronic features CABOT CORPORATION 2003-08-28 US disclosed
US-20030148024-A1 Low viscosity precursor compositons and methods for the depositon of conductive electronic features CABOT CORPORATION 2003-08-07 US disclosed
US-20030124259-A1 Metal precursor compound; and agent that reduces the conversion temperature of said precursor by at least 25 degrees C.; viscosity of at least 1000 centipoise CABOT CORPORATION 2003-07-03 US disclosed
US-20030108664-A1 Depositing silver metal precursor into portion of recessed feature, heating to temperature of not greater than 400 degrees C to convert precursor to conductor having resistivity of not greater than 10 times resistivity of metal CABOT CORPORATION 2003-06-12 US disclosed
WO-2003035279-A1 TAPE COMPOSITIONS FOR THE DEPOSITION OF ELECTRONIC FEATURES SUPERIOR MICROPOWDERS LLC (US) 2003-05-01 WO disclosed
WO-2003032084-A2 LOW VISCOSITY PRECURSOR COMPOSITIONS AND METHODS FOR THE DEPOSITION OF CONDUCTIVE ELECTRONIC FEATURES SUPERIOR MICROPOWDERS LLC (US) 2003-04-17 WO disclosed