SCHEMBL2498084

SCHEMBL2498084

OCC=CC(Cl)(Cl)Cl

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11874730 0.80
SCHEMBL7693993 0.75
SCHEMBL7696888 0.75
SCHEMBL9640032 0.71
SCHEMBL18853753 0.69
SCHEMBL10732233 0.69
SCHEMBL10679983 0.69
SCHEMBL28859286 0.67 ALDH1A1 (0.30)
SCHEMBL2498080 0.67
SCHEMBL22115813 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024010476-A1 METHOD OF MANUFACTURING CERAMIC MATRIX COMPOSITES REINFORCED WITH METALLIC PARTICLES POLITECHNIKA WARSZAWSKA (PL) 2024-01-11 WO claimed
CN-108682830-B Silicon-carbon composite negative electrode material of lithium ion battery and preparation method thereof 清华大学深圳研究生院 2020-08-18 CN claimed
WO-2024010476-A1 METHOD OF MANUFACTURING CERAMIC MATRIX COMPOSITES REINFORCED WITH METALLIC PARTICLES POLITECHNIKA WARSZAWSKA (PL) 2024-01-11 WO disclosed
WO-2024010476-A1 METHOD OF MANUFACTURING CERAMIC MATRIX COMPOSITES REINFORCED WITH METALLIC PARTICLES POLITECHNIKA WARSZAWSKA (PL) 2024-01-11 WO disclosed
CN-108682830-B Silicon-carbon composite negative electrode material of lithium ion battery and preparation method thereof 清华大学深圳研究生院 2020-08-18 CN disclosed
EP-2905349-B1 Ag ball, solder joint, formed solder, solder paste and silver paste SENJU METAL INDUSTRY CO (JP) 2017-05-17 EP disclosed
US-9266196-B2 Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2016-02-23 US disclosed
EP-2905349-A2 Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2015-08-12 EP disclosed
US-20150217409-A1 Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE Senju Metal lndustry Co., Ltd. (JP) 2015-08-06 US disclosed
CN-104816104-A Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste SENJU METAL INDUSTRY CO 2015-08-05 CN disclosed
US-8030529-B2 Process for the preparation of intermediates SYNGENTA CROP PROTECTION, INC. (US) 2011-10-04 US disclosed
WO-2000078712-A1 SUBSTITUTED ARYLMALONIC ACID DINITRILES AS INTERMEDIATES FOR THE PREPARTION OF HERBICIDES SYNGENTA PARTICIPATIONS AG (CH) 2000-12-28 WO disclosed
WO-2000078881-A2 PROCESS FOR THE PREPARATION OF HERBICIDAL DERIVATIVES SYGENTA PARTICIPATIONS AG (CH) 2000-12-28 WO disclosed
EP-0966461-A1 PYRAZOLE DERIVATIVES AS HERBICIDES Novartis AG (CH) 1999-12-29 EP disclosed
WO-1999052893-A1 N-PYRIDONYL HERBICIDES NOVARTIS AG (CH) 1999-10-21 WO disclosed
WO-1998042698-A1 PYRAZOLE DERIVATIVES AS HERBICIDES NOVARTIS AG (CH) 1998-10-01 WO disclosed
US-5716458-A CLEANING BY VAPORIZATION, CONDENSATION OF AN AZEOTROPIC LIQUID MIXTURE; HALOGEN-FREE NIKON CORPORATION (JP) 1998-02-10 US disclosed
US-5397518-A Process for forming ceramic pixel array and pixel array formed thereby TEXAS INSTRUMENTS INCORPORATED (US) 1995-03-14 US disclosed
US-5164346-A Fiber reinforced, porosity, flexibility KERAMONT ITALIA, S.P.A. (IT) 1992-11-17 US disclosed
US-4111933-A PROTECTION OF FUNCTIONAL GROUPS DURING REACTION AND THEIR SUBSEQUENT RESTORATION BAYER AKTIENGESELLSCHAFT (DE) 1978-09-05 US disclosed