SCHEMBL2501151

SCHEMBL2501151

COC(C[SiH2]CCC#N)OC

nearest known ligand 0.33

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.33
ALDH1A1 P00352 1/20 0.30
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25399981 0.89 TSHR (0.37) TSHR
SCHEMBL31026683 0.80 TSHR (0.37) TSHR
SCHEMBL705326 0.77
SCHEMBL25398600 0.72 TSHR (0.39) TSHR
SCHEMBL704961 0.72
SCHEMBL704277 0.72
SCHEMBL29224795 0.71 ALDH1A1 (0.36) TSHRALDH1A1
SCHEMBL441892 0.70
SCHEMBL8167268 0.70
SCHEMBL29512638 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025217238-A1 SUBSTRATES WITH RESIN COMPOSITION ADHERED THERETO AND METHODS FOR IMPROVING ADHESION TO A SUBSTRATE MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2025-10-16 WO claimed
US-20250313681-A1 SUBSTRATES WITH RESIN COMPOSITION ADHERED THERETO AND METHODS FOR IMPROVING ADHESION TO A SUBSTRATE MOMENTIVE PERFORMANCE MAT INC (US) 2025-10-09 US claimed
EP-4423186-A1 CONDENSATION CURABLE COMPOSITION Momentive Performance Materials Inc. (US) 2024-09-04 EP claimed
CN-118382664-A Condensation curable composition 迈图高新材料公司 2024-07-23 CN claimed
US-11760900-B2 Condensation curable composition MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2023-09-19 US claimed
WO-2023076316-A1 CONDENSATION CURABLE COMPOSITION MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2023-05-04 WO claimed
US-20230127458-A1 CONDENSATION CURABLE COMPOSITION MOMENTIVE PERFORMANCE MATERIALS INC. 2023-04-27 US claimed
WO-2025217238-A1 SUBSTRATES WITH RESIN COMPOSITION ADHERED THERETO AND METHODS FOR IMPROVING ADHESION TO A SUBSTRATE MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2025-10-16 WO disclosed
US-20250313681-A1 SUBSTRATES WITH RESIN COMPOSITION ADHERED THERETO AND METHODS FOR IMPROVING ADHESION TO A SUBSTRATE MOMENTIVE PERFORMANCE MAT INC (US) 2025-10-09 US disclosed
CN-118382664-A Condensation curable composition 迈图高新材料公司 2024-07-23 CN disclosed
US-11760900-B2 Condensation curable composition MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2023-09-19 US disclosed
US-20230127458-A1 CONDENSATION CURABLE COMPOSITION MOMENTIVE PERFORMANCE MATERIALS INC. 2023-04-27 US disclosed
US-20110245398-A1 METHOD FOR PRODUCING CONJUGATED DIENE POLYMER COMPOSITION SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2011-10-06 US disclosed
CN-102206353-A Method for producing conjugated diene polymer composition SUMITOMO CHEMICAL CO 2011-10-05 CN disclosed