Acetic Acid Methyl Ester

Acetic Acid Methyl Ester

SCHEMBL2501435

CC(=O)OCCO.COC(C)=O

nearest known ligand 0.53

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.53
CHRM5 P08912 2/20 0.46
CHRM1 P11229 2/20 0.46
CHRM3 P20309 2/20 0.46
TSHR P16473 2/20 0.46
PGR P06401 1/20 0.46
CHRM2 P08172 1/20 0.46
CHRM4 P08173 1/20 0.46
HTR1A P08908 1/20 0.46
CHRNB2 P17787 1/20 0.46
TBXA2R P21731 1/20 0.46
CHRNB4 P30926 1/20 0.46
CHRNA3 P32297 1/20 0.46
CHRNA7 P36544 1/20 0.46
CHRNA4 P43681 1/20 0.46
SMN1; SMN2 Q16637 1/20 0.46
CHRNA10 Q9GZZ6 1/20 0.46
CHRNA9 Q9UGM1 1/20 0.46
GALR3 O60755 2/20 0.45
GAA P10253 2/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Methoxymethane SCHEMBL210145 0.92 ALDH1A1 (0.50) ALDH1A1CHRM5CHRM1CHRM3TSHR
SCHEMBL27796 0.92
SCHEMBL3070371 0.92 ALDH1A1 (0.55) ALDH1A1CHRM5CHRM1CHRM3TSHR
SCHEMBL4951741 0.89 ALDH1A1 (0.56) ALDH1A1CHRM5CHRM1CHRM3TSHR
SCHEMBL21580547 0.89
SCHEMBL25232908 0.89
SCHEMBL15106933 0.89
Ethylene Glycol SCHEMBL7784600 0.89 ALDH1A1 (0.52) ALDH1A1CHRM5CHRM1CHRM3TSHR
Water SCHEMBL58538 0.89
SCHEMBL2047002 0.89

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8466229-B2 Composition for forming silica-based film, method of forming silica-based film, and electronic component provided with silica-based film HITACHI CHEMICAL CO., LTD. (JP) 2013-06-18 US disclosed
US-8253251-B2 Method for producing low-k film, semiconductor device, and method for manufacturing the same ELPIDA MEMORY, INC. (JP) 2012-08-28 US disclosed
US-8030221-B2 Method for producing low-k l film, semiconductor device, and method for manufacturing the same ELPIDA MEMORY, INC. (JP) 2011-10-04 US disclosed
US-20100289143-A1 METHOD FOR PRODUCING LOW-k FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SAME ELPIDA MEMORY, INC (JP) 2010-11-18 US disclosed
US-7687590-B2 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-03-30 US disclosed
US-7682701-B2 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts HITACHI CHEMICAL CO., LTD. (JP) 2010-03-23 US disclosed
US-20090110838-A1 Composition for forming silica-based film, method of forming silica-based film, and electronic component provided with silica-based film HITACHI CHEMICAL CO., LTD (JP) 2009-04-30 US disclosed
US-7358300-B2 Comprising polysiloxane obtained by hydrolytic condensation; alcoholic solvent alcohol capable of dissolving siloxane resin, ammonium salt, and thermal decomposing/volatile compound; curing; bonding and high strength; mechanical properties HITACHI CHEMICAL CO., LTD. (JP) 2008-04-15 US disclosed
US-20060052566-A1 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts HITACHI CHEMICAL CO., LTD. (JP) 2006-03-09 US disclosed
US-20060047034-A1 Composition for forming silica-based film, method of forming silica-based film, and electronic component provided with silica-based film HITACHI CHEMICAL CO., LTD. (JP) 2006-03-02 US disclosed
US-20050255326-A1 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts HITACHI CHEMICAL CO., LTD. (JP) 2005-11-17 US disclosed
US-20050119394-A1 Comprising polysiloxane obtained by hydrolytic condensation; alcoholic solvent alcohol capable of dissolving siloxane resin, ammonium salt, and thermal decomposing/volatile compound; curing; bonding and high strength; mechanical properties HITACHI CHEMICAL CO., LTD. (JP) 2005-06-02 US disclosed