SCHEMBL25044210

SCHEMBL25044210

CC(OC(=O)CCCCN1C(=O)C=CC1=O)C(F)(F)F

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PTGS1 P23219 7/20 0.49
PTGS2 P35354 7/20 0.49
MGLL Q99685 7/20 0.44
FAAH O00519 5/20 0.44
ALDH1A1 P00352 3/20 0.43
MAPT P10636 2/20 0.43
HPGD P15428 2/20 0.43
LMNA P02545 2/20 0.43
HSP90AA1 P07900 1/20 0.43
TLR9 Q9NR96 1/20 0.43
TP53 P04637 1/20 0.43
PKM P14618 1/20 0.43
XBP1 P17861 1/20 0.43
MAPK1 P28482 1/20 0.43
HTT P42858 1/20 0.43
RECQL P46063 1/20 0.43
RAB9A P51151 1/20 0.43
SMN1; SMN2 Q16637 1/20 0.43
NPSR1 Q6W5P4 1/20 0.43
GPR35 Q9HC97 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15024114 0.83 PTGS1 (0.44) PTGS1PTGS2MGLLFAAHALDH1A1
SCHEMBL821215 0.82 PTGS1 (0.58) PTGS1PTGS2MGLLFAAHALDH1A1
SCHEMBL15024034 0.80 PTGS1 (0.55) PTGS1PTGS2MGLLFAAHALDH1A1
SCHEMBL13807555 0.77 PTGS1 (0.49) PTGS1PTGS2MGLLFAAHALDH1A1
SCHEMBL15023896 0.77 PTGS1 (0.55) PTGS1PTGS2MGLLFAAHALDH1A1
SCHEMBL13807318 0.77 PTGS1 (0.51) PTGS1PTGS2MGLLFAAHALDH1A1
SCHEMBL15024046 0.75 MAPT (0.46) PTGS1PTGS2MGLLFAAHALDH1A1
SCHEMBL15999209 0.75 PTGS1 (0.49) PTGS1PTGS2MGLLFAAHALDH1A1
SCHEMBL18712252 0.74 PTGS1 (0.55) PTGS1PTGS2MGLLFAAHALDH1A1
SCHEMBL822926 0.74 PTGS1 (0.64) PTGS1PTGS2MGLLFAAHALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230050585-A1 RESIST MATERIAL AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-02-16 US disclosed