SCHEMBL2515532

SCHEMBL2515532

[Bi].[In].[Zn]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7639136 1.00
SCHEMBL6748967 0.87
SCHEMBL31612939 0.87
SCHEMBL5492039 0.87
SCHEMBL2531332 0.87
SCHEMBL1508939 0.87
SCHEMBL5532048 0.87
SCHEMBL264665 0.87
SCHEMBL211065 0.82
SCHEMBL636147 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 105 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025229143-A1 METHOD FOR PREPARING A CATALYST COMPOSITION AVANTIUM KNOWLEDGE CENTRE B.V. (NL) 2025-11-06 WO claimed
CN-118895109-A Thermal interface material and preparation method thereof 深圳先进电子材料国际创新研究院 2024-11-05 CN claimed
CN-108265318-B Method and device for preparing flexible battery cathode powder 上海移宇科技股份有限公司 2019-12-20 CN claimed
CN-110306079-A A kind of low melting point liquid metal and the preparation method and application thereof 云南科威液态金属谷研发有限公司 2019-10-08 CN claimed
CN-108265318-A Method and device for preparing negative electrode powder of flexible battery 上海移宇科技股份有限公司 2018-07-10 CN claimed
CN-104269557-B The application process of a kind of zinc cathode additive agent in zinc-nickel secondary batteries CENTRAL SOUTH UNIVERSITY (CN) 2016-05-25 CN claimed
CN-103579588-B The ternary layered composite oxides of a kind of zinc-base are used as the purposes of zinc-nickel battery electrode material CENTRAL SOUTH UNIVERSITY (CN) 2015-08-05 CN claimed
CN-104269557-A Applying method of zinc electrode additive in zinc and nickel secondary battery UNIV CENTRAL SOUTH 2015-01-07 CN claimed
CN-103579588-A Application of zinc-based ternary layered composite oxide to zinc-nickel battery electrode material UNIV CENTRAL SOUTH 2014-02-12 CN claimed
CN-103579595-A Application of zinc-based binary layered composite oxide to zinc-nickel battery electrode material UNIV CENTRAL SOUTH 2014-02-12 CN claimed
CN-102263262-B Method for using anionic zinc houghite for preparing zinc cathode of zinc-nickel secondary battery UNIV CENTRAL SOUTH 2013-09-11 CN claimed
CN-102263260-B Application of zinc based polynary hydrotalcite in preparation of zinc negative pole of zinc-nickel secondary battery UNIV CENTRAL SOUTH 2013-04-24 CN claimed
CN-102956875-A Carbon-coated zinc-base hydrotalcite preparation and application method of carbon-coated zinc-base hydrotalcite in zinc-nickel secondary battery UNIV CENTRAL SOUTH 2013-03-06 CN claimed
CN-102044669-B Zinc cathode active substance of zinc-nickel secondary battery and preparation method and application method thereof UNIV CENTRAL SOUTH 2012-10-03 CN claimed
CN-102263260-A Application of zinc based polynary hydrotalcite in preparation of zinc negative pole of zinc-nickel secondary battery 2011-11-30 CN claimed
CN-102263262-A Method for using anionic zinc houghite for preparing zinc cathode of zinc-nickel secondary battery UNIV CENTRAL SOUTH 2011-11-30 CN claimed
CN-102044669-A Zinc cathode active substance of zinc-nickel secondary battery and preparation method and application method thereof UNIV CENTRAL SOUTH 2011-05-04 CN claimed
CN-1036408-C Special electrode for preparing L-semicystine by electrolytic reduction UNIV FUJIAN (CN) 1997-11-12 CN claimed
CN-1089000-A The electrode special that is used for preparing L-semicystine by electrolytic reduction UNIV FUJIAN (CN) 1994-07-06 CN claimed
US-20260150750-A1 ELECTRONIC PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF ACER INCORPORATED (TW) 2026-05-28 US disclosed
US-20260150682-A1 ELECTRONIC PACKAGE STRUCTURE MANUFACTURING METHOD THEREOF ACER INCORPORATED (TW) 2026-05-28 US disclosed
EP-3472888-B1 ALKALINE ELECTROCHEMICAL CELL WITH IMPROVED ANODE AND SEPARATOR COMPONENTS VARTA CONSUMER BATTERIES GMBH & CO KGAA (DE) 2026-03-04 EP disclosed
EP-4439656-B1 SEMICONDUCTOR DEVICE WINCHAIN MATERIAL TECH CO LTD (TW) 2026-03-04 EP disclosed
WO-2025229143-A1 METHOD FOR PREPARING A CATALYST COMPOSITION AVANTIUM KNOWLEDGE CENTRE B.V. (NL) 2025-11-06 WO disclosed
US-20250309239-A1 ALKALINE ELECTROCHEMICAL CELL WITH IMPROVED ANODE AND SEPARATOR COMPONENTS ENERGIZER BRANDS, LLC 2025-10-02 US disclosed
US-12341186-B2 Alkaline electrochemical cell with improved anode and separator components ENERGIZER BRANDS, LLC (US) 2025-06-24 US disclosed
EP-4571828-A2 SEMICONDUCTOR DEVICE Morningrich Technology Co., Ltd. (TW) 2025-06-18 EP disclosed
CN-119560468-A Packaging heat radiation structure for large-size high-power artificial intelligent chip 南京大学 2025-03-04 CN disclosed
CN-118895109-A Thermal interface material and preparation method thereof 深圳先进电子材料国际创新研究院 2024-11-05 CN disclosed
US-20240332217-A1 SEMICONDUCTOR DEVICE MORNINGRICH TECHNOLOGY CO., LTD. (TW) 2024-10-03 US disclosed
EP-4439656-A2 SEMICONDUCTOR DEVICE Morningrich Technology Co., Ltd. (TW) 2024-10-02 EP disclosed
CN-118737993-A Semiconductor device with a semiconductor device having a plurality of semiconductor chips 裕晨科技股份有限公司 2024-10-01 CN disclosed
CN-118693016-A Packaging structure of chip and integrated radiator 宏碁股份有限公司 2024-09-24 CN disclosed
CN-221728788-U Enclose frame and radiating component for heat dissipation 祐权电子(深圳)有限公司 2024-09-17 CN disclosed
US-20240297092-A1 PACKAGE STRUCTURE OF CHIP AND INTEGRATED HEAT SPREADER ACER INCORPORATED (TW) 2024-09-05 US disclosed
EP-4057337-B1 ELECTRONIC DEVICE ADOPTING HEAT DISSIPATION STRUCTURE WINCHAIN MATERIAL TECH CO LTD (TW) 2024-08-28 EP disclosed
EP-4199073-B1 ELECTRONIC DEVICE ADOPTING HEAT DISSIPATION STRUCTURE WINCHAIN MATERIAL TECH CO LTD (TW) 2024-08-07 EP disclosed
CN-118448366-A Electronic packaging module 宏碁股份有限公司 2024-08-06 CN disclosed
US-20240258198-A1 ELECTRONIC PACKAGE MODULE ACER INCORPORATED (TW) 2024-08-01 US disclosed
EP-4407674-A1 ELECTRONIC PACKAGE MODULE Acer Incorporated (TW) 2024-07-31 EP disclosed
CN-118366975-A Electronic packaging structure 宏碁股份有限公司 2024-07-19 CN disclosed
US-20240243114-A1 ELECTRONIC PACKAGE STRUCTURE ACER INCORPORATED (TW) 2024-07-18 US disclosed
CN-117766531-A Electronic packaging structure 宏碁股份有限公司 2024-03-26 CN disclosed
US-20240055417-A1 ELECTRONIC PACKAGE STRUCTURE ACER INCORPORATED (TW) 2024-02-15 US disclosed
CN-117412547-A Thermoelectric heat dissipation device and derivative application product thereof 马思正 2024-01-16 CN disclosed
US-20230395784-A1 ALKALINE ELECTROCHEMICAL CELL WITH IMPROVED ANODE AND SEPARATOR COMPONENTS JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT 2023-12-07 US disclosed
US-11758691-B2 Heat dissipation structure and electronic device adopting the same MORNINGRICH TECHNOLOGY CO., LTD. (TW) 2023-09-12 US disclosed
US-11757088-B2 Alkaline electrochemical cell with improved anode and separator components ENERGIZER BRANDS, LLC (US) 2023-09-12 US disclosed
EP-4199073-A1 ELECTRONIC DEVICE ADOPTING HEAT DISSIPATION STRUCTURE Morningrich Technology Co., Ltd (TW) 2023-06-21 EP disclosed
US-20230180441-A1 HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE ADOPTING THE SAME MORNINGRICH TECHNOLOGY CO., LTD. (TW) 2023-06-08 US disclosed
EP-4057337-A1 ELECTRONIC DEVICE ADOPTING HEAT DISSIPATION STRUCTURE Morningrich Technology Co., Ltd (TW) 2022-09-14 EP disclosed
CN-217283843-U Heat radiation structure 颀权股份有限公司 2022-08-23 CN disclosed
CN-216848674-U Heat sink device 华越科技股份有限公司 2022-06-28 CN disclosed
CN-215991758-U Metal heat conducting sheet structure with particle and phase change 东莞钱锋特殊胶粘制品有限公司 2022-03-08 CN disclosed
US-11264607-B2 Alkaline electrochemical cell with improved anode and separator components ENERGIZER BRANDS, LLC (US) 2022-03-01 US disclosed
CN-215834516-U Heat conducting device for electronic element 东莞钱锋特殊胶粘制品有限公司 2022-02-15 CN disclosed
CN-215121667-U Heat radiation structure 颀权股份有限公司 2021-12-10 CN disclosed
US-20210337696-A1 HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE ADOPTING THE SAME MORNINGRICH TECHNOLOGY CO., LTD. (TW) 2021-10-28 US disclosed
CN-214504361-U Heat sink device 裕晨科技股份有限公司 2021-10-26 CN disclosed
CN-110306079-B Low-melting-point liquid metal and preparation method and application thereof 云南科威液态金属谷研发有限公司 2021-01-26 CN disclosed
CN-211982421-U Heat sink device 裕晨科技股份有限公司 2020-11-20 CN disclosed
US-10693125-B2 Alkaline electrochemical cell with improved anode and separator components ENERGIZER BRANDS, LLC (US) 2020-06-23 US disclosed
US-20200161637-A1 ALKALINE ELECTROCHEMICAL CELL WITH IMPROVED ANODE AND SEPARATOR COMPONENTS JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT 2020-05-21 US disclosed
CN-108265318-B Method and device for preparing flexible battery cathode powder 上海移宇科技股份有限公司 2019-12-20 CN disclosed
CN-107275611-B A kind of spherical zinc oxide material of nanometer and preparation method of polypyrrole cladding 南昌航空大学 2019-11-29 CN disclosed
CN-110391429-A A kind of alkaline Mn cell 横店集团东磁股份有限公司 2019-10-29 CN disclosed
CN-110306079-A A kind of low melting point liquid metal and the preparation method and application thereof 云南科威液态金属谷研发有限公司 2019-10-08 CN disclosed
US-20190214632-A1 ALKALINE ELECTROCHEMICAL CELL WITH IMPROVED ANODE AND SEPARATOR COMPONENTS JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT 2019-07-11 US disclosed
CN-109964359-A Alkaline electrochemical cell with improved anode and separator assembly 劲量品牌有限责任公司 2019-07-02 CN disclosed
EP-3472888-A1 ALKALINE ELECTROCHEMICAL CELL WITH IMPROVED ANODE AND SEPARATOR COMPONENTS Spectrum Brands, Inc. (US) 2019-04-24 EP disclosed
CN-108265318-A Method and device for preparing negative electrode powder of flexible battery 上海移宇科技股份有限公司 2018-07-10 CN disclosed
US-20170365830-A1 ALKALINE ELECTROCHEMICAL CELL WITH IMPROVED ANODE AND SEPARATOR COMPONENTS JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT 2017-12-21 US disclosed
CN-107275611-A The spherical zinc oxide material of nanometer and preparation method of a kind of polypyrrole cladding 南昌航空大学 2017-10-20 CN disclosed
CN-106550547-A A kind of printed circuit color printing apparatus, method and printed circuit 北京梦之墨科技有限公司 2017-03-29 CN disclosed
CN-103579595-B A kind of zinc-base binary layered mixed oxide is as the purposes of zinc-nickel cell electrode material CENTRAL SOUTH UNIVERSITY (CN) 2016-05-25 CN disclosed
CN-104269557-B The application process of a kind of zinc cathode additive agent in zinc-nickel secondary batteries CENTRAL SOUTH UNIVERSITY (CN) 2016-05-25 CN disclosed
CN-103579588-B The ternary layered composite oxides of a kind of zinc-base are used as the purposes of zinc-nickel battery electrode material CENTRAL SOUTH UNIVERSITY (CN) 2015-08-05 CN disclosed
CN-104269557-A Applying method of zinc electrode additive in zinc and nickel secondary battery UNIV CENTRAL SOUTH 2015-01-07 CN disclosed
CN-103579588-A Application of zinc-based ternary layered composite oxide to zinc-nickel battery electrode material UNIV CENTRAL SOUTH 2014-02-12 CN disclosed
CN-103579595-A Application of zinc-based binary layered composite oxide to zinc-nickel battery electrode material UNIV CENTRAL SOUTH 2014-02-12 CN disclosed
CN-102560088-B Composite chlorinating metallurgy method for full-value utilization of complex poor tin middling ore GEJIU CITY FUXIANG INDUSTRY AND TRADE CO LTD 2013-10-02 CN disclosed
CN-102263262-B Method for using anionic zinc houghite for preparing zinc cathode of zinc-nickel secondary battery UNIV CENTRAL SOUTH 2013-09-11 CN disclosed
CN-102263260-B Application of zinc based polynary hydrotalcite in preparation of zinc negative pole of zinc-nickel secondary battery UNIV CENTRAL SOUTH 2013-04-24 CN disclosed
CN-102956875-A Carbon-coated zinc-base hydrotalcite preparation and application method of carbon-coated zinc-base hydrotalcite in zinc-nickel secondary battery UNIV CENTRAL SOUTH 2013-03-06 CN disclosed
EP-2556182-A1 MECHANICALLY PLATED PELLETS AND METHOD OF MANUFACTURE Advanced Lighting Technologies, Inc. (US) 2013-02-13 EP disclosed
CN-102892925-A Mechanically plated pellets and method of manufacture ADVANCED LIGHTING TECH INC 2013-01-23 CN disclosed
CN-102044669-B Zinc cathode active substance of zinc-nickel secondary battery and preparation method and application method thereof UNIV CENTRAL SOUTH 2012-10-03 CN disclosed
CN-101282817-B Bulk metallic glass solder INTEL CORP 2012-07-18 CN disclosed
CN-102560088-A Composite chlorinating metallurgy method for full-value utilization of complex poor tin middling ore GEJIU CITY FUXIANG INDUSTRY AND TRADE CO LTD 2012-07-11 CN disclosed
CN-102263262-A Method for using anionic zinc houghite for preparing zinc cathode of zinc-nickel secondary battery UNIV CENTRAL SOUTH 2011-11-30 CN disclosed
CN-102263260-A Application of zinc based polynary hydrotalcite in preparation of zinc negative pole of zinc-nickel secondary battery 2011-11-30 CN disclosed
WO-2011127480-A1 MECHANICALLY PLATED PELLETS AND METHOD OF MANUFACTURE ADVANCED LIGHTING TECHNOLOGIES, INC. (US) 2011-10-13 WO disclosed
US-20110250455-A1 MECHANICALLY PLATED PELLETS AND METHOD OF MANUFACTURE EPIC DESIGN SERVICES GROUP, INC. 2011-10-13 US disclosed
CN-102044669-A Zinc cathode active substance of zinc-nickel secondary battery and preparation method and application method thereof UNIV CENTRAL SOUTH 2011-05-04 CN disclosed
US-20100037990-A1 BULK METALLIC GLASS SOLDER MATERIAL SUH DAEWOONG 2010-02-18 US disclosed
US-7628871-B2 Solder materials formed from alloys possessing deep eutectics with asymmetric liquidous slopes; BMG solder materials are stronger and have a higher elastic modulus than, and therefore are less likely than crystalline solder materials to damage fragile low k interlayer dielectric materials; ex: tin-indium INTEL CORPORATION (US) 2009-12-08 US disclosed
CN-101282817-A Bulk metallic glass solder INTEL CORP (US) 2008-10-08 CN disclosed
EP-1539411-B1 USE IN ELECTROCHEMICAL CELLS OF A ZINC POWDER NORANDA INC (CA) 2007-04-18 EP disclosed
WO-2007021492-A1 BULK METALLIC GLASS SOLDER INTEL CORPORATION (US) 2007-02-22 WO disclosed
US-20070034305-A1 Solder materials formed from alloys possessing deep eutectics with asymmetric liquidous slopes; BMG solder materials are stronger and have a higher elastic modulus than, and therefore are less likely than crystalline solder materials to damage fragile low k interlayer dielectric materials; ex: tin-indium INTEL CORPORATION 2007-02-15 US disclosed
CN-1869264-A Mercury alloy for low pressure gas discharge lamp HE ZHIMING (CN) 2006-11-29 CN disclosed
US-20040115532-A1 Zinc powders for use in electrochemical cells NORANDA INC. (CA) 2004-06-17 US disclosed
WO-2004021483-A1 ZINC ALLOY CONTAINING A BISMUTH-INDIUM INTERMETALLIC COMPOUND FOR USE IN ALKALINE BATTERIES BIG RIVER ZINC CORPORATION (US) 2004-03-11 WO disclosed
CN-1036408-C Special electrode for preparing L-semicystine by electrolytic reduction UNIV FUJIAN (CN) 1997-11-12 CN disclosed
CN-1089000-A The electrode special that is used for preparing L-semicystine by electrolytic reduction UNIV FUJIAN (CN) 1994-07-06 CN disclosed
CN-1089000-A The electrode special that is used for preparing L-semicystine by electrolytic reduction UNIV FUJIAN (CN) 1994-07-06 CN disclosed