SCHEMBL25202065

SCHEMBL25202065

[CH2]COOC(C)(C)CCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25199769 0.86
SCHEMBL25195648 0.79
SCHEMBL96705 0.78 TSHR (0.35)
SCHEMBL8765762 0.78
SCHEMBL29943513 0.75 LMNA (0.30)
SCHEMBL9354593 0.75
SCHEMBL25207447 0.74
SCHEMBL3315723 0.74
SCHEMBL28224015 0.73
SCHEMBL23699023 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230323114-A1 ALIPHATIC-POLYESTER-BASED RESIN COMPOSITION AND UTILIZATION THEREOF KANEKA CORPORATION (JP) 2023-10-12 US disclosed
WO-2023190185-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2023-10-05 WO disclosed
WO-2023190183-A1 CROSSLINKED RESIN PARTICLES AND METHOD FOR PRODUCING SAME 株式会社カネカ 2023-10-05 WO disclosed
WO-2023190184-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2023-10-05 WO disclosed
EP-4183828-A1 ALIPHATIC-POLYESTER-BASED RESIN COMPOSITION AND UTILIZATION THEREOF Kaneka Corporation (JP) 2023-05-24 EP disclosed