SCHEMBL2525866

SCHEMBL2525866

CC1(C)C[Si](C)(C)[Si](C)(C)[Si](C)(c2ccccc2)O1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29085711 0.92
SCHEMBL7102827 0.84
SCHEMBL5552263 0.79 GRIN1 (0.31)
SCHEMBL2119153 0.76
SCHEMBL29082263 0.75
SCHEMBL10387800 0.74
SCHEMBL28430938 0.73
SCHEMBL11080256 0.69 HSD11B1 (0.31)
SCHEMBL297374 0.68
SCHEMBL94184 0.68

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 141 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240258111-A1 Surface Treatment Compositions and Methods FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2024-08-01 US claimed
CN-111757896-B Method for preparing solid catalyst 博里利斯股份公司 2023-10-13 CN claimed
CN-111565859-B Surface treatment composition and method 富士胶片电子材料美国有限公司 2022-12-30 CN claimed
US-11447642-B2 Methods of using surface treatment compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2022-09-20 US claimed
US-11174394-B2 Surface treatment compositions and articles containing same FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2021-11-16 US claimed
EP-3830196-A1 SURFACE TREATMENT COMPOSITIONS AND METHODS FUJIFILM Electronic Materials U.S.A, Inc. (US) 2021-06-09 EP claimed
US-20210122925-A1 METHODS OF USING SURFACE TREATMENT COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2021-04-29 US claimed
EP-1457802-B1 Micro-mirror device including dielectrophoretic liquid TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2021-03-17 EP claimed
CN-112513192-A Surface treatment composition and method 富士胶片电子材料美国有限公司 2021-03-16 CN claimed
EP-3735325-A1 SURFACE TREATMENT COMPOSITIONS AND METHODS FUJIFILM Electronic Materials U.S.A, Inc. (US) 2020-11-11 EP claimed
US-20070077782-A1 Treatment of low dielectric constant films using a batch processing system TOKYO ELECTRON LIMITED (JP) 2007-04-05 US claimed
US-20070077353-A1 Plasma-assisted vapor phase treatment of low dielectric constant films using a batch processing system TOKYO ELECTRON LIMITED (JP) 2007-04-05 US claimed
US-20070077781-A1 Plural treatment step process for treating dielectric films TOKYO ELECTRON LIMTED (JP) 2007-04-05 US claimed
WO-2006091264-A1 METHOD AND SYSTEM FOR TREATING A DIELECTRIC FILM TOKYO ELECTRON LIMITED (JP) 2006-08-31 WO claimed
US-20050215072-A1 Method and system for treating a dielectric film TOKYO ELECTRON LIMITED (JP) 2005-09-29 US claimed
US-6924922-B2 Micro-mirror device including dielectrophoretic liquid HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2005-08-02 US claimed
US-20050088767-A1 Micro-Mirror device including dielectrophoretic liquid TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2005-04-28 US claimed
US-6844953-B2 Micro-mirror device including dielectrophoretic liquid HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2005-01-18 US claimed
US-20040179281-A1 Micro-mirror device including dielectrophoretic liquid TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMTED (TW) 2004-09-16 US claimed
EP-1457802-A1 Micro-mirror device including dielectrophoretic liquid Hewlett-Packard Development Company, L.P. (US) 2004-09-15 EP claimed