Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 4/20 | 0.47 |
| ▸ | CYP2C19 | P33261 | 3/20 | 0.47 |
| ▸ | CYP2D6 | P10635 | 3/20 | 0.47 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.46 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.46 |
| ▸ | CTNNB1 | P35222 | 1/20 | 0.42 |
| ▸ | ACP3 | P15309 | 1/20 | 0.41 |
| ▸ | NQO2 | P16083 | 1/20 | 0.39 |
| ▸ | NR1I2 | O75469 | 1/20 | 0.39 |
| ▸ | DRD2 | P14416 | 1/20 | 0.39 |
| ▸ | ADRA2C | P18825 | 1/20 | 0.39 |
| ▸ | CNR1 | P21554 | 1/20 | 0.39 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.39 |
| ▸ | HTR2A | P28223 | 1/20 | 0.39 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.39 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.39 |
| ▸ | OPRK1 | P41145 | 1/20 | 0.39 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.39 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.39 |
| ▸ | EBP | Q15125 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30540146 | 0.85 | CYP1A2 (0.36) | CYP1A2CYP2C19CYP2D6TDP1CYP2C9 | |
| SCHEMBL7919050 | 0.80 | CYP2D6 (0.59) | CYP1A2CYP2C19CYP2D6TDP1CYP2C9 | |
| Iodide SCHEMBL30254970 | 0.79 | CYP1A2 (0.57) | CYP1A2CYP2C19CYP2D6TDP1CYP2C9 | |
| Hydrochloric Acid SCHEMBL10800502 | 0.79 | CYP1A2 (0.57) | CYP1A2CYP2C19CYP2D6TDP1CYP2C9 | |
| SCHEMBL12938548 | 0.76 | CYP1A2 (0.52) | CYP1A2CYP2C19CYP2D6TDP1CYP2C9 | |
| Hydrochloric Acid SCHEMBL7893086 | 0.75 | TDP1 (0.47) | CYP1A2CYP2C19CYP2D6TDP1CYP2C9 | |
| SCHEMBL26858755 | 0.74 | CYP1A2 (0.47) | CYP1A2CYP2C19CYP2D6TDP1CYP2C9 | |
| SCHEMBL4649846 | 0.73 | TAAR1 (0.41) | CYP1A2CYP2C19CYP2D6TDP1LMNA | |
| SCHEMBL4649328 | 0.73 | GABRA1 (0.36) | CYP2C19CYP2D6TDP1LMNATSHR | |
| Bromide SCHEMBL5127807 | 0.72 | TAAR1 (0.40) | CYP1A2CYP2C19CYP2D6TDP1LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2025013728-A1 | ADHESIVE BODY AND METHOD FOR PRODUCING SAME | 株式会社レゾナック | 2025-01-16 | — | — | WO | disclosed |
| WO-2025013726-A1 | ADHESIVE COMPOSITION | 株式会社レゾナック | 2025-01-16 | — | — | WO | disclosed |
| CN-118742619-A | Adhesive composition, adhesive film for circuit connection, and method for producing connection structure | 株式会社力森诺科 | 2024-10-01 | — | — | CN | disclosed |
| CN-118525070-A | Adhesive composition, adhesive film for circuit connection, and method for producing connection structure | 株式会社力森诺科 | 2024-08-20 | — | — | CN | disclosed |
| WO-2024150762-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE | 株式会社レゾナック | 2024-07-18 | — | — | WO | disclosed |
| WO-2024150766-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE | 株式会社レゾナック | 2024-07-18 | — | — | WO | disclosed |
| WO-2024150767-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE | 株式会社レゾナック | 2024-07-18 | — | — | WO | disclosed |
| WO-2023171633-A1 | ELECTRICALLY CONDUCTIVE PARTICLE, ADHESIVE FILM FOR CIRCUIT CONNECTION AND METHOD FOR MANUFACTURING SAME, AND CONNECTION STRUCTURE BODY AND METHOD FOR MANUFACTURING SAME | 株式会社レゾナック | 2023-09-14 | — | — | WO | disclosed |
| WO-2023171634-A1 | CONDUCTIVE PARTICLES, ADHESIVE FILM FOR CIRCUIT CONNECTION, PRODUCTION METHOD THEREFOR, CONNECTION STRUCTURE, AND PRODUCTION METHOD THEREFOR | 株式会社レゾナック | 2023-09-14 | — | — | WO | disclosed |
| WO-2023136273-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, AND METHOD FOR PRODUCING CONNECTION STRUCTURE | 株式会社レゾナック | 2023-07-20 | — | — | WO | disclosed |
| WO-2023136274-A1 | ADHESIVE AGENT COMPOSITION, ADHESIVE AGENT FILM FOR CIRCUIT CONNECTION, AND MANUFACTURING METHOD FOR CONNECTION STRUCTURE | 株式会社レゾナック | 2023-07-20 | — | — | WO | disclosed |
| WO-2022224934-A1 | ADHESIVE COMPOSITION AND METHOD FOR PRODUCING CONNECTION STRUCTURE | 昭和電工マテリアルズ株式会社 | 2022-10-27 | — | — | WO | disclosed |