Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29399494 | 0.81 | — | — | |
| SCHEMBL29163275 | 0.81 | — | — | |
| SCHEMBL218134 | 0.81 | — | — | |
| SCHEMBL392488 | 0.80 | — | — | |
| SCHEMBL28485653 | 0.78 | — | — | |
| SCHEMBL7097574 | 0.78 | CES2 (0.35) | — | |
| SCHEMBL125971 | 0.77 | — | — | |
| SCHEMBL5083906 | 0.77 | NPC1 (0.30) | — | |
| SCHEMBL4876968 | 0.76 | CYP1A2 (0.31) | CYP1A2CYP2A6 | |
| Lithium Ion SCHEMBL10622024 | 0.75 | CES2 (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240321803-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2024-09-26 | — | — | US | disclosed |
| US-20240272551-A1 | NEGATIVE-TYPE PHOTOSENSITIVE POLYMER, POLYMER SOLUTION, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2024-08-15 | — | — | US | disclosed |
| CN-116848467-A | Photosensitive resin composition, cured film, and semiconductor device | 住友电木株式会社 | 2023-10-03 | — | — | CN | disclosed |
| WO-2022270529-A1 | NEGATIVE PHOTOSENSITIVE POLYMER, POLYMER SOLUTION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE | 住友ベークライト株式会社 | 2022-12-29 | — | — | WO | disclosed |
| WO-2022270527-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE POLMER, CURED FILM AND SEMICONDUCTOR DEVICE | 住友ベークライト株式会社 | 2022-12-29 | — | — | WO | disclosed |
| WO-2022172988-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE | 住友ベークライト株式会社 | 2022-08-18 | — | — | WO | disclosed |
| US-8089593-B2 | Optical resin film, optical compensation sheet, polarizing plate and liquid crystal display | FUJIFILM CORPORATION (JP) | 2012-01-03 | — | — | US | disclosed |
| US-8084563-B2 | Cyclic olefin addition copolymer, process for production thereof, and retardation film obtained from the copolymer | JSR CORPORATION (JP) | 2011-12-27 | — | — | US | disclosed |
| US-7719644-B2 | Optical compensation sheet, polarizing plate and liquid crystal display | FUJIFILM CORPORATION (JP) | 2010-05-18 | — | — | US | disclosed |
| US-7675587-B2 | Polarizing plate and process for producing the same | JSR CORPORATION (JP) | 2010-03-09 | — | — | US | disclosed |
| WO-2006082818-A1 | POLARIZING PLATE AND LIQUID CRYSTAL DISPLAY DEVICE | FUJIFILM CORPORATION (JP) | 2006-08-10 | — | — | WO | disclosed |
| US-7049220-B2 | Method of forming cavity between multilayered wirings | JSR CORPORATION (JP) | 2006-05-23 | — | — | US | disclosed |
| EP-1657259-A1 | PROCESS FOR PRODUCING CYCLOOLEFIN ADDITION POLYMER | JSR Corporation (JP) | 2006-05-17 | — | — | EP | disclosed |
| US-7015293-B2 | Cycloolefin addition copolymer and optical transparent material | JSR CORPORATION (JP) | 2006-03-21 | — | — | US | disclosed |
| EP-1626294-A2 | Polarizing plate and process for producing the same | JSR Corporation (JP) | 2006-02-15 | — | — | EP | disclosed |
| US-20060027322-A1 | Polarizing plate and process for producing the same | JSR CORPORATION (JP) | 2006-02-09 | — | — | US | disclosed |
| US-20050171310-A1 | Cycloolefin addition copolymer and optical transparent material | JSR CORPORATION (JP) | 2005-08-04 | — | — | US | disclosed |
| EP-1538169-A1 | CYCLOOLEFIN ADDITION COPOLYMER AND OPTICAL TRANSPARENT MATERIAL | JSR Corporation (JP) | 2005-06-08 | — | — | EP | disclosed |
| US-20040132243-A1 | Method of forming cavity between multilayered wirings | JSR CORPORATION (JP) | 2004-07-08 | — | — | US | disclosed |
| EP-1416528-A2 | Method of forming cavity between multilayered wirings | JSR Corporation (JP) | 2004-05-06 | — | — | EP | disclosed |