SCHEMBL25307198

SCHEMBL25307198

CC1CCCCC1CC1(C(=O)O)CCCCC1C

nearest known ligand 0.32

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
USP2 O75604 1/20 0.32
EPHX1 P07099 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29603054 0.79 CYP1A2 (0.34)
SCHEMBL13464578 0.78 CYP1A2 (0.33)
SCHEMBL844686 0.74
SCHEMBL620855 0.74 USP2 (0.31) USP2
SCHEMBL4396297 0.74
SCHEMBL16267569 0.73
SCHEMBL16116754 0.72 CYP1A2 (0.38)
SCHEMBL3544348 0.71 LMNA (0.34) EPHX1
SCHEMBL3541280 0.70 CYP1A2 (0.37) USP2
SCHEMBL22341263 0.70 CYP1A2 (0.37)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023136299-A1 METHOD FOR LOWERING BONDING STRENGTH OF ADHESIVE LAYER 学校法人早稲田大学 2023-07-20 WO disclosed
WO-2023068109-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE 株式会社ADEKA 2023-04-27 WO disclosed