Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | THRB | P10828 | 1/20 | 0.50 |
| ▸ | TSHR | P16473 | 4/20 | 0.44 |
| ▸ | GLO1 | Q04760 | 1/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 9/20 | 0.42 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.39 |
| ▸ | LMNA | P02545 | 1/20 | 0.39 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.39 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.38 |
| ▸ | MGAM | O43451 | 1/20 | 0.38 |
| ▸ | GAA | P10253 | 1/20 | 0.38 |
| ▸ | SI | P14410 | 1/20 | 0.38 |
| ▸ | MGAM2 | Q2M2H8 | 1/20 | 0.38 |
| ▸ | MAPT | P10636 | 2/20 | 0.36 |
| ▸ | CYP2D6 | P10635 | 2/20 | 0.36 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.36 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.35 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5831741 | 0.90 | THRB (0.55) | THRBTSHRGLO1ALDH1A1NPSR1 | |
| SCHEMBL4713738 | 0.88 | THRB (0.53) | THRBTSHRGLO1ALDH1A1NPSR1 | |
| Ethylamine SCHEMBL4364175 | 0.87 | THRB (0.57) | THRBTSHRGLO1ALDH1A1NPSR1 | |
| SCHEMBL27798356 | 0.85 | THRB (0.55) | THRBTSHRGLO1ALDH1A1NPSR1 | |
| Propene SCHEMBL20853733 | 0.85 | THRB (0.55) | THRBTSHRGLO1ALDH1A1NPSR1 | |
| Butadiene SCHEMBL2354922 | 0.85 | THRB (0.55) | THRBTSHRGLO1ALDH1A1NPSR1 | |
| Ethylenediamine SCHEMBL4650024 | 0.85 | THRB (0.61) | THRBTSHRGLO1ALDH1A1NPSR1 | |
| SCHEMBL5576923 | 0.85 | THRB (0.55) | THRBTSHRGLO1ALDH1A1NPSR1 | |
| Hydroxyamine SCHEMBL29435122 | 0.85 | THRB (0.59) | THRBTSHRGLO1ALDH1A1NPSR1 | |
| Methylamine SCHEMBL202768 | 0.85 | THRB (0.59) | THRBTSHRGLO1ALDH1A1NPSR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 53 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2346474-B1 | POWDERY STYLING COMPOSITIONS | HENKEL AG & CO KGAA (DE) | 2013-05-22 | — | — | EP | claimed |
| CN-110073470-B | Adhesive tape for semiconductor processing | 古河电气工业株式会社 | 2023-10-17 | — | — | CN | disclosed |
| CN-109075055-B | Adhesive tape for protecting surface of semiconductor wafer and method for processing semiconductor wafer | 古河电气工业株式会社 | 2023-08-15 | — | — | CN | disclosed |
| CN-112368108-B | Adhesive tape for glass processing | 古河电气工业株式会社 | 2022-11-04 | — | — | CN | disclosed |
| CN-112368106-B | Adhesive tape for glass processing | 古河电气工业株式会社 | 2022-11-01 | — | — | CN | disclosed |
| CN-111742026-B | Ultraviolet-curable adhesive tape for semiconductor wafer processing, method for producing semiconductor chip, and method for using the tape | 古河电气工业株式会社 | 2022-05-24 | — | — | CN | disclosed |
| CN-114364761-A | Adhesive tape for semiconductor processing | 古河电气工业株式会社 | 2022-04-15 | — | — | CN | disclosed |
| CN-108137845-B | System and method for producing cast-in-place foam | 巴斯夫欧洲公司 | 2021-08-17 | — | — | CN | disclosed |
| US-11091601-B2 | Process for producing an in-situ foam | BASF SE (DE) | 2021-08-17 | — | — | US | disclosed |
| CN-107112222-B | Wafer fixing tape, semiconductor wafer processing method and semiconductor chip | 古河电气工业株式会社 | 2021-03-16 | — | — | CN | disclosed |
| US-20060204749-A1 | Wafer-processing tape | THE FURUKAWA ELECTRIC CO., LTD. | 2006-09-14 | — | — | US | disclosed |
| US-7081503-B2 | Process producing vinyl polymer having alkenyl group at end, vinyl polymer, and curable composition | KANEKA CORPORATION (JP) | 2006-07-25 | — | — | US | disclosed |
| US-7009004-B2 | Process for producing vinyl polymer having alkenyl group at end vinyl polymer and curable composition | KANEKA CORPORATION (JP) | 2006-03-07 | — | — | US | disclosed |
| US-20060004171-A1 | Process for producing vinyl polymer having alkenyl group at end, vinyl polymer, and curable composition | TSUJI RYOTARO | 2006-01-05 | — | — | US | disclosed |
| US-20050249909-A1 | Wafer-adhering adhesive tape | THE FURUKAWA ELECTRIC CO., LTD. | 2005-11-10 | — | — | US | disclosed |
| EP-1591504-A1 | PRESSURE-SENSITIVE ADHESIVE TAPE FOR PASTING WAFER THERETO | The Furukawa Electric Co., Ltd. (JP) | 2005-11-02 | — | — | EP | disclosed |
| US-20050004318-A1 | Curable composition | OHSHIRO NOBUAKI (JP) | 2005-01-06 | — | — | US | disclosed |
| EP-1452550-A1 | CURABLE COMPOSITION | KANEKA CORPORATION (JP) | 2004-09-01 | — | — | EP | disclosed |
| US-20040097678-A1 | Process for producing vinyl polymer having alkenyl group at end vinyl polymer and curable composition | KANEKA CORPORATION (JP) | 2004-05-20 | — | — | US | disclosed |
| EP-1375531-A1 | PROCESS FOR PRODUCING VINYL POLYMER HAVING ALKENYL GROUP AT END, VINYL POLYMER, AND CURABLE COMPOSITION | KANEKA CORPORATION (JP) | 2004-01-02 | — | — | EP | disclosed |