SCHEMBL2548277

SCHEMBL2548277

CC1(C)CC2(CC(C)(C)c3cc(O)c(O)cc3O2)Oc2cc(O)c(O)cc21

nearest known ligand 0.51

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
FTO Q9C0B1 2/20 0.51
ALDH1A1 P00352 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31232341 1.00 FTO (0.51) FTOALDH1A1
SCHEMBL12997667 0.92 FTO (0.46) FTOALDH1A1
SCHEMBL16601851 0.92 FTO (0.46) FTOALDH1A1
SCHEMBL3615121 0.87 FTO (0.44) FTOALDH1A1
SCHEMBL30471544 0.87 FTO (0.44) FTOALDH1A1
SCHEMBL13607193 0.87 FTO (0.48) FTOALDH1A1
SCHEMBL9327955 0.86 FTO (0.61) FTOALDH1A1
SCHEMBL14564009 0.84 FTO (0.46) FTOALDH1A1
SCHEMBL15867653 0.83 FTO (0.53) FTOALDH1A1
SCHEMBL22923356 0.81 BACE1 (0.43) FTOALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112457501-A Electro-reversible skin-adhesive hydrogel and preparation method and application thereof 厦门大学 2021-03-09 CN claimed
US-20230178848-A1 ELECTRODE SEPARATORS UNIV KING ABDULLAH SCI & TECH (SA) 2023-06-08 US disclosed
US-20230178848-A1 ELECTRODE SEPARATORS UNIV KING ABDULLAH SCI & TECH (SA) 2023-06-08 US disclosed
US-20210355364-A1 COMPOSITION FOR FORMING THERMALLY CONDUCTIVE MATERIAL, AND THERMALLY CONDUCTIVE MATERIAL FUJIFILM CORPORATION (JP) 2021-11-18 US disclosed
CN-112457501-A Electro-reversible skin-adhesive hydrogel and preparation method and application thereof 厦门大学 2021-03-09 CN disclosed
US-20160367948-A1 CROSSLINKED POLYMER, METHOD FOR PRODUCING THE SAME, MOLECULAR SIEVE COMPOSITION AND MATERIAL SEPARATION MEMBRANES KYOTO UNIVERSITY (JP) 2016-12-22 US disclosed
US-20160367948-A1 CROSSLINKED POLYMER, METHOD FOR PRODUCING THE SAME, MOLECULAR SIEVE COMPOSITION AND MATERIAL SEPARATION MEMBRANES KYOTO UNIVERSITY (JP) 2016-12-22 US disclosed
US-9395863-B2 Touch panel and display device FUJIFILM CORPORATION (JP) 2016-07-19 US disclosed
US-9395863-B2 Touch panel and display device FUJIFILM CORPORATION (JP) 2016-07-19 US disclosed
US-20160168418-A1 HEAT-CURABLE COMPOSITION JNC CORPORATION (JP) 2016-06-16 US disclosed
US-7514203-B2 Positive photoresist composition SAMYANGEMS CO., LTD. (KR) 2009-04-07 US disclosed
US-20080166656-A1 Positive Photoresist Composition SAM YANG EMS CO., LTD. 2008-07-10 US disclosed
WO-2007069798-A1 POSITIVE PHOTORESIST COMPOSITION SAMYANGEMS CO., LTD. (KR) 2007-06-21 WO disclosed
EP-0477691-B1 Positive-type photoresist composition FUJI PHOTO FILM CO LTD (JP) 1997-07-16 EP disclosed
US-5340686-A Alkali soluble phenol novolak resin, 1,2-quinone diazide compound and low molecular weight novolak compound FUJI PHOTO FILM CO., LTD. (JP) 1994-08-23 US disclosed
EP-0307951-B1 Light-sensitive resin composition FUJI PHOTO FILM CO LTD (JP) 1994-03-02 EP disclosed
EP-0477691-A2 Positive-type photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1992-04-01 EP disclosed
US-4883739-A PHOTORESISTS FUJI PHOTO FILM CO., LTD. (JP) 1989-11-28 US disclosed
EP-0307951-A2 Light-sensitive resin composition FUJI PHOTO FILM CO., LTD. (JP) 1989-03-22 EP disclosed
US-4332886-A Color photographic light-sensitive material including an organic spirobis compound color coupler FUJI PHOTO FILM CO., LTD. (JP) 1982-06-01 US disclosed