SCHEMBL25657903

SCHEMBL25657903

CCC(C)(C)C(=O)NCC1C2CC3C1OC(=O)C3(C#N)C2

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17577429 0.84 — —
SCHEMBL9973378 0.81 HMGCR (0.31) —
SCHEMBL25657901 0.81 — —
SCHEMBL25657902 0.79 — —
SCHEMBL16139542 0.78 — —
SCHEMBL107167 0.77 HMGCR (0.32) —
SCHEMBL19058052 0.77 HMGCR (0.32) —
SCHEMBL10228568 0.77 HMGCR (0.32) —
SCHEMBL16810003 0.77 HMGCR (0.32) —
SCHEMBL18898095 0.76 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11709425-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-25 — — US disclosed
US-11703756-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-18 — — US disclosed
US-11650497-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2023-05-16 — — US disclosed
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