⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL144636 | 0.67 | — | — | |
| SCHEMBL382 | 0.61 | — | — | |
| SCHEMBL39657 | 0.61 | — | — | |
| SCHEMBL11291825 | 0.61 | — | — | |
| SCHEMBL2030 | 0.61 | — | — | |
| SCHEMBL1174125 | 0.61 | — | — | |
| SCHEMBL4580233 | 0.61 | — | — | |
| SCHEMBL9713068 | 0.61 | — | — | |
| SCHEMBL639752 | 0.50 | — | — | |
| SCHEMBL1292 | 0.50 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 120 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3896114-B1 | POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHINETSU CHEMICAL CO (JP) | 2023-10-18 | — | — | EP | disclosed |
| US-11572442-B2 | Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2023-02-07 | — | — | US | disclosed |
| CN-113527101-A | Novel compound, polymer and method for producing same, photosensitive resin composition, method for forming pattern, cured film, and electronic component | 信越化学工业株式会社 | 2021-10-22 | — | — | CN | disclosed |
| EP-3896114-A1 | NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2021-10-20 | — | — | EP | disclosed |
| US-20210317270-A1 | NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-14 | — | — | US | disclosed |
| EP-3352281-B1 | NON-AQUEOUS ELECTROLYTE SOLUTION AND NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY | ADEKA CORP (JP) | 2021-08-11 | — | — | EP | disclosed |
| US-10734684-B2 | Nonaqueous electrolyte solution and nonaqueous electrolyte secondary battery | ADEKA CORPORATION (JP) | 2020-08-04 | — | — | US | disclosed |
| EP-2781347-B1 | TRANSPARENT ELECTRODE AND ELECTRONIC DEVICE | KONICA MINOLTA INC (JP) | 2019-11-20 | — | — | EP | disclosed |
| US-10355236-B2 | Transparent electrode and electronic device | Konica Minolta, Inc. (JP) | 2019-07-16 | — | — | US | disclosed |
| US-10209619-B2 | Composition and method of forming pattern using composition | JSR CORPORATION (JP) | 2019-02-19 | — | — | US | disclosed |
| US-6415093-B1 | RADIATION TRANSPARENT ADHESIVE | NIPPON SHEET GLASS CO., LTD. (JP) | 2002-07-02 | — | — | US | disclosed |
| US-6335143-B1 | Resist composition containing specific cross-linking agent | WAKO PURE CHEMICAL INDUSTRIES LTD. (JP) | 2002-01-01 | — | — | US | disclosed |
| EP-0887706-A1 | Resist composition containing specific cross-linking agent | WAKO PURE CHEMICAL INDUSTRIES, LTD (JP) | 1998-12-30 | — | — | EP | disclosed |
| EP-0324476-B1 | Silver halide color photosensitive materials | FUJI PHOTO FILM CO LTD (JP) | 1995-06-21 | — | — | EP | disclosed |
| US-5242788-A | Improved image storage stability, little staining | FUJI PHOTO FILM CO., LTD. (JP) | 1993-09-07 | — | — | US | disclosed |
| US-5162197-A | Support with hydrophilic colloid layer containing cyan dye forming coupler and solvent; colorfastness, no coloration in background | FUJI PHOTO FILM CO., LTD. (JP) | 1992-11-10 | — | — | US | disclosed |
| US-5009989-A | Silver halide photographic material | FUJI PHOTO FILM CO., LTD. (JP) | 1991-04-23 | — | — | US | disclosed |
| EP-0324476-A2 | Silver halide color photosensitive materials | FUJI PHOTO FILM CO., LTD. (JP) | 1989-07-19 | — | — | EP | disclosed |
| EP-0307935-A2 | Silver halide photographic material | FUJI PHOTO FILM CO., LTD. (JP) | 1989-03-22 | — | — | EP | disclosed |
| US-4013618-A | NITROGEN-CONTAINING STABILIZER | TOYOBO CO., LTD. (JA) | 1977-03-22 | — | — | US | disclosed |