SCHEMBL25812517

SCHEMBL25812517

C=C(CC(=O)O)C(=O)Nc1ccc(Oc2ccc(C)cc2)cc1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FNTA P49354 2/20 0.51
FNTB P49356 2/20 0.51
ALDH1A1 P00352 2/20 0.48
PNLIP P16233 1/20 0.48
HPGD P15428 4/20 0.48
NPC1 O15118 3/20 0.48
RAB9A P51151 3/20 0.48
CRHBP P24387 1/20 0.48
CRHR2 Q13324 1/20 0.48
LTA4H P09960 1/20 0.47
HTT P42858 2/20 0.47
LMNA P02545 1/20 0.47
GAA P10253 1/20 0.47
ALOX15 P16050 1/20 0.47
TSHR P16473 1/20 0.47
MAPK1 P28482 1/20 0.47
L3MBTL1 Q9Y468 1/20 0.47
GALR3 O60755 1/20 0.46
SMN1; SMN2 Q16637 1/20 0.45
KDM4E B2RXH2 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23966424 0.81 RXFP1 (0.54) FNTAFNTBALDH1A1PNLIPHPGD
SCHEMBL23966411 0.79 POLB (0.57) FNTAFNTBALDH1A1PNLIPHPGD
SCHEMBL5034247 0.76 POLB (0.55) ALDH1A1NPC1RAB9AHTTL3MBTL1
SCHEMBL26659405 0.76 CYP1A1 (0.53) ALDH1A1LMNAGAATSHRMAPK1
SCHEMBL5176170 0.76 SMN1; SMN2 (0.50) ALDH1A1HPGDNPC1RAB9AHTT
SCHEMBL2301719 0.74 POLB (0.57) ALDH1A1NPC1RAB9AHTTL3MBTL1
SCHEMBL5612841 0.74 TDP1 (0.77) ALDH1A1PNLIPHPGDNPC1RAB9A
SCHEMBL23323205 0.74 POLB (0.68) FNTAFNTBALDH1A1PNLIPHPGD
SCHEMBL12994776 0.73 HPGD (0.65) FNTAFNTBPNLIPHPGDNPC1
SCHEMBL2172248 0.73 MTNR1A (0.64) FNTAFNTBALDH1A1PNLIPHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230221639-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-07-13 US disclosed
US-11640112-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-05-02 US disclosed