SCHEMBL2583601

SCHEMBL2583601

C=CC(=O)O[Si](C)(OCC)OCC

nearest known ligand 0.39

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TSHR P16473 8/20 0.39
HPGD P15428 1/20 0.39
ALDH1A1 P00352 5/20 0.35
TP53 P04637 3/20 0.35
HIF1A Q16665 3/20 0.35
CYP3A4 P08684 2/20 0.35
MAPK1 P28482 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
HSD17B10 Q99714 1/20 0.34
THRB P10828 3/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27539971 0.90 TSHR (0.36) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL27511672 0.86 TSHR (0.38) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL27806782 0.84 TSHR (0.46) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL10432392 0.83 TSHR (0.39) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL10592974 0.82 TSHR (0.39) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL5227421 0.81 TSHR (0.41) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL28316592 0.79 TSHR (0.39) TSHRHPGDALDH1A1TP53HIF1A
Acrylic Acid SCHEMBL31483535 0.78 LMNA (0.46) TSHRHPGDALDH1A1HSD17B10
SCHEMBL27730778 0.78 HCAR2 (0.32)
SCHEMBL14660004 0.78 TSHR (0.38) TSHRHPGDALDH1A1TP53HIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025127152-A1 METAL OXIDE PARTICLES HAVING IMPROVED HYDROPHOBICITY, HIGHLY CONCENTRATED METAL OXIDE SOL, AND METHODS FOR PRODUCING SAME 日産化学株式会社 2025-06-19 WO disclosed
CN-117377722-A Rubber composition and tire 株式会社普利司通 2024-01-09 CN disclosed
CN-113195547-B Photocurable composition for imprinting 日产化学株式会社 2023-08-11 CN disclosed
CN-110678160-B Dental adhesive composition, its preparation and use 3M创新有限公司 2022-12-30 CN disclosed
CN-111465659-B Coating composition for sealing surfaces 瓦克化学股份公司 2022-09-27 CN disclosed
CN-114206605-A Tape, article comprising tape and composite layer, and related methods 3M创新有限公司 2022-03-18 CN disclosed
CN-113166549-A Multicomponent crosslinkable materials based on organooxysilane-terminated polymers 瓦克化学股份公司 2021-07-23 CN disclosed
CN-107923176-B Self-sealing article comprising an elastic porous layer 3M创新有限公司 2021-05-28 CN disclosed
CN-109803826-B Laminate and method for producing same 信越化学工业株式会社 2021-05-11 CN disclosed
CN-107922797-B Air and water barrier article having porous layer and liner 3M创新有限公司 2021-03-05 CN disclosed
CN-102300925-A Curable composition 2011-12-28 CN disclosed
US-8048615-B2 Silicon-containing resist underlayer coating forming composition for forming photo-crosslinking cured resist underlayer coating NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2011-11-01 US disclosed
CN-102216362-A Method for sealing surfaces WACKER CHEMIE AG 2011-10-12 CN disclosed
CN-101981087-A Curable composition and method for producing organosilicon compound TOAGOSEI CO LTD 2011-02-23 CN disclosed
CN-100590149-C Curable resin composition and moisture-curing adhesive composition KONISHI CO LTD 2010-02-17 CN disclosed
US-20090162782-A1 Silicon-Containing Resist Underlayer Coating Forming Composition for Forming Photo-Crosslinking Cured Resist Underlayer Coating NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2009-06-25 US disclosed
CN-100478363-C Curable composition containing surface-modified particles CONSORTIUM ELEKTROCHEM IND (DE) 2009-04-15 CN disclosed
CN-101322074-A Silicon-containing resist underlying layer film forming composition for formation of photocrosslinking cured resist underlying layer film NISSAN CHEMICAL IND LTD (JP) 2008-12-10 CN disclosed
CN-1934138-A Curable composition containing surface-modified particles CONSORTIUM ELEKTROCHEM IND (DE) 2007-03-21 CN disclosed
CN-1823139-A Curable resin composition and moisture-curing adhesive composition KONISHI CO LTD (JP) 2006-08-23 CN disclosed