Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | USP2 | O75604 | 2/20 | 0.55 |
| ▸ | HTT | P42858 | 2/20 | 0.53 |
| ▸ | SPHK1 | Q9NYA1 | 1/20 | 0.49 |
| ▸ | LPAR5 | Q9H1C0 | 1/20 | 0.46 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.45 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.42 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.42 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.42 |
| ▸ | TSHR | P16473 | 1/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.41 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.41 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.41 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.40 |
| ▸ | LMNA | P02545 | 2/20 | 0.39 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.39 |
| ▸ | CASR | P41180 | 1/20 | 0.38 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.38 |
| ▸ | HPGD | P15428 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3968392 | 0.92 | USP2 (0.67) | USP2HTTSPHK1LPAR5HSD17B10 | |
| SCHEMBL2988607 | 0.92 | USP2 (0.67) | USP2HTTSPHK1LPAR5HSD17B10 | |
| SCHEMBL578059 | 0.92 | USP2 (0.67) | USP2HTTSPHK1LPAR5HSD17B10 | |
| SCHEMBL2994684 | 0.92 | USP2 (0.67) | USP2HTTSPHK1LPAR5HSD17B10 | |
| SCHEMBL8454480 | 0.92 | USP2 (0.67) | USP2HTTSPHK1LPAR5HSD17B10 | |
| SCHEMBL2981072 | 0.92 | USP2 (0.67) | USP2HTTSPHK1LPAR5HSD17B10 | |
| SCHEMBL3964904 | 0.92 | USP2 (0.67) | USP2HTTSPHK1LPAR5HSD17B10 | |
| SCHEMBL12802300 | 0.92 | USP2 (0.67) | USP2HTTSPHK1LPAR5HSD17B10 | |
| Bromide SCHEMBL2229414 | 0.90 | USP2 (0.65) | USP2HTTSPHK1LPAR5HSD17B10 | |
| SCHEMBL14507015 | 0.89 | HSD17B10 (0.56) | USP2HTTSPHK1LPAR5HSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 250 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3713984-B1 | ADHESIVE TAPES BASED ON EPOXY RESIN REACTIVE ADHESIVES | TESA SE (DE) | 2023-11-01 | — | — | EP | claimed |
| US-20220306908-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2022-09-29 | — | — | US | claimed |
| US-20220275252-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2022-09-01 | — | — | US | claimed |
| WO-2021032822-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2021-02-25 | — | — | WO | claimed |
| WO-2021032727-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2021-02-25 | — | — | WO | claimed |
| EP-3713984-A1 | ADHESIVE TAPES BASED ON EPOXY RESIN REACTIVE ADHESIVES | TESA SE (DE) | 2020-09-30 | — | — | EP | claimed |
| WO-2019101916-A1 | CURABLE COMPOSITION BASED ON FATTY-ACID MODIFIED EPOXY RESINS AND CURING AGENTS | TESA SE (DE) | 2019-05-31 | — | — | WO | claimed |
| WO-2019101914-A1 | ADHESIVE TAPES BASED ON EPOXY RESIN REACTIVE ADHESIVES | TESA SE (DE) | 2019-05-31 | — | — | WO | claimed |
| US-8063161-B2 | Low temperature curing acrylate and maleimide based formulations and methods for use thereof | DESIGNER MOLECULES, INC. (US) | 2011-11-22 | — | — | US | claimed |
| US-20100063184-A1 | LOW TEMPERATURE CURING ACRYLATE AND MALEIMIDE BASED FORMULATIONS AND METHODS FOR USE THEREOF | DESIGNER MOLECULES, INC. (US) | 2010-03-11 | — | — | US | claimed |
| WO-2008130894-A1 | LOW TEMPERATURE CURING ACRYLATE AND MALEIMIDE BASED FORMULATIONS AND METHODS FOR USE THEREOF | DESIGNER MOLECULES, INC. (US) | 2008-10-30 | — | — | WO | claimed |
| US-4546155-A | ADDUCT OF EPOXY COMPOUND, TERTIARY AMINE COMPOUND, AND CARBOXYLIC ACID ANHYDRIDE | AJINOMOTO CO., INC. (JP) | 1985-10-08 | — | — | US | claimed |
| US-4542202-A | EPOXY COMPOUND WITH A HYDROXY, MERCAPTO, OR HYDRAZIDE MODIFIED TERTIARY AMINE | AJINOMOTO CO., INC. (JP) | 1985-09-17 | — | — | US | claimed |
| EP-4748870-A1 | EPOXY RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2026-05-27 | — | — | EP | disclosed |
| EP-4748869-A1 | EPOXY RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED ARTICLE, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2026-05-27 | — | — | EP | disclosed |
| WO-2026100231-A1 | CURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-4546155-A | ADDUCT OF EPOXY COMPOUND, TERTIARY AMINE COMPOUND, AND CARBOXYLIC ACID ANHYDRIDE | AJINOMOTO CO., INC. (JP) | 1985-10-08 | — | — | US | disclosed |
| US-4542202-A | EPOXY COMPOUND WITH A HYDROXY, MERCAPTO, OR HYDRAZIDE MODIFIED TERTIARY AMINE | AJINOMOTO CO., INC. (JP) | 1985-09-17 | — | — | US | disclosed |
| EP-0138465-A2 | Latent curing agents for epoxy resins | AJINOMOTO CO., INC. (JP) | 1985-04-24 | — | — | EP | disclosed |
| EP-0104837-A2 | Latent curing agents for epoxy resins | AJINOMOTO CO., INC. (JP) | 1984-04-04 | — | — | EP | disclosed |