Biphenyl

Biphenyl

SCHEMBL258610

O=PO.[Zn].c1ccc(-c2ccccc2)cc1

nearest known ligand 0.56

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ ALDH1A1 P00352 2/20 0.56
▸ MMP3 P08254 1/20 0.48
▸ BCL2L1 Q07817 1/20 0.48
▸ IDH1 O75874 1/20 0.44
▸ MAPT P10636 2/20 0.44
▸ SMN1; SMN2 Q16637 1/20 0.44
▸ LMNA P02545 2/20 0.42
▸ HTT P42858 2/20 0.42
▸ ABCC4 O15439 1/20 0.42
▸ GAA P10253 1/20 0.42
▸ TSHR P16473 1/20 0.42
▸ PTGS1 P23219 1/20 0.42
▸ CA1 P00915 1/20 0.42
▸ CA2 P00918 1/20 0.42
▸ MGLL Q99685 1/20 0.42
▸ KIF11 P52732 1/20 0.42
▸ MAPK1 P28482 1/20 0.41
▸ CYP1A2 P05177 1/20 0.41
▸ CYP3A4 P08684 1/20 0.41
▸ TAAR1 Q96RJ0 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Biphenyl SCHEMBL6029133 0.97 ALDH1A1 (0.60) ALDH1A1MMP3BCL2L1MAPTSMN1; SMN2
Biphenyl SCHEMBL27389033 0.97 ALDH1A1 (0.60) ALDH1A1MMP3BCL2L1MAPTSMN1; SMN2
Biphenyl SCHEMBL258693 0.97 ALDH1A1 (0.60) ALDH1A1MMP3BCL2L1MAPTSMN1; SMN2
Biphenyl SCHEMBL258507 0.94 ALDH1A1 (0.56) ALDH1A1MMP3BCL2L1MAPTSMN1; SMN2
Biphenyl SCHEMBL258561 0.94 ALDH1A1 (0.56) ALDH1A1MMP3BCL2L1MAPTSMN1; SMN2
Biphenyl SCHEMBL258699 0.94 ALDH1A1 (0.56) ALDH1A1MMP3BCL2L1MAPTSMN1; SMN2
SCHEMBL27586211 0.82 ALDH1A1 (0.52) ALDH1A1BCL2L1SMN1; SMN2MAPK1HSD17B10
SCHEMBL29012884 0.79 — —
Biphenyl SCHEMBL27650730 0.79 ALDH1A1 (0.75) ALDH1A1MMP3BCL2L1MAPTSMN1; SMN2
Biphenyl SCHEMBL547965 0.79 ALDH1A1 (0.90) ALDH1A1MMP3BCL2L1MAPTSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112300543-A Halogen-free flame-retardant PET material and preparation method thereof 利尔化学股份有限公司 2021-02-02 — — CN claimed
CN-116285337-B Polyamide composition, method for producing same, and molded article 旭化成株式会社 2025-05-30 — — CN disclosed
CN-119899523-A Polyamide composition and molded article 旭化成株式会社 2025-04-29 — — CN disclosed
CN-113631641-B Yellow pigment composition 巴斯夫欧洲公司 2025-02-25 — — CN disclosed
CN-119029467-A Multifunctional battery cover for automobile 旭化成株式会社 2024-11-26 — — CN disclosed
CN-115443309-B Colored polyamide resin composition and molded article thereof 株式会社可乐丽 2024-10-29 — — CN disclosed
CN-118515970-A Continuous fiber reinforced composite material and method for producing same 旭化成株式会社 2024-08-20 — — CN disclosed
CN-114761478-B Polyamide resin composition and molded article thereof 株式会社可乐丽 2024-08-13 — — CN disclosed
CN-118344728-A Molded article, method for producing molded article subjected to laser marking, and laser marking method 旭化成株式会社 2024-07-16 — — CN disclosed
CN-113380463-B Manufacturing method of flexible flat cable and flexible flat cable 亳州联滔电子有限公司 2024-06-25 — — CN disclosed
US-20190002638-A1 SEMIAROMATIC POLYAMIDE RESIN AND PREPARATION METHOD THEREOF AND POLYAMIDE MOLDING COMPOSITION CONSISTING OF THE SAME KINGFA SCI. & TECH. CO., LTD. (CN) 2019-01-03 — — US disclosed
US-20190002639-A1 SEMIAROMATIC COPOLYAMIDE RESIN AND POLYAMIDE MOLDING COMPOSITION CONSISTING OF THE SAME KINGFA SCI. & TECH. CO., LTD. (CN) 2019-01-03 — — US disclosed
EP-3375821-A1 SEMI-AROMATIC POLYAMIDE RESIN, METHOD FOR PREPARING SAME, AND POLYAMIDE MOLDING COMPOSITION CONSISTING OF SAME Zuhai Vanteque Specialty Engineering Plastics Co., Ltd. (CN) 2018-09-19 — — EP disclosed
EP-3339351-A1 SEMI-AROMATIC COPOLYAMIDE RESIN AND POLYAMIDE MOLDING COMPOSITION CONSISTING OF SEMI-AROMATIC COPOLYAMIDE RESIN Kingfa Sci. & Tech. Co., Ltd. (CN) 2018-06-27 — — EP disclosed
US-8053500-B2 Flame-retardant polyamide resin composition and molded article MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2011-11-08 — — US disclosed
US-20110200811-A1 FLAME-RETARDANT POLYBUTYLENE TEREPHTHALATE SERIES RESIN COMPOSITION MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2011-08-18 — — US disclosed
EP-2322577-A1 FLAME-RETARDANT POLYBUTYLENE TEREPHTHALATE-BASED RESIN COMPOSITION Mitsubishi Engineering-Plastics Corporation (JP) 2011-05-18 — — EP disclosed
EP-2100919-B1 FLAME-RETARDANT POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE MITSUBISHI ENG PLASTICS CORP (JP) 2011-03-09 — — EP disclosed
US-20100069539-A1 FLAME-RETARDANT POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2010-03-18 — — US disclosed
EP-2100919-A1 FLAME-RETARDANT POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE Mitsubishi Engineering-Plastics Corporation (JP) 2009-09-16 — — EP disclosed
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