Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 3/20 | 0.76 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.76 |
| ▸ | HPGD | P15428 | 2/20 | 0.69 |
| ▸ | AGER | Q15109 | 2/20 | 0.58 |
| ▸ | MAPT | P10636 | 2/20 | 0.58 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.58 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.55 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.54 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.54 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.54 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.54 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.52 |
| ▸ | TSHR | P16473 | 2/20 | 0.50 |
| ▸ | LMNA | P02545 | 2/20 | 0.50 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.50 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.50 |
| ▸ | RECQL | P46063 | 1/20 | 0.50 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.47 |
| ▸ | HTT | P42858 | 1/20 | 0.46 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL24982068 | 0.92 | MEN1 (0.66) | MEN1KMT2AHPGDAGERMAPT | |
| SCHEMBL24982895 | 0.89 | MEN1 (0.76) | MEN1KMT2AHPGDAGERMAPT | |
| SCHEMBL29886581 | 0.89 | MEN1 (0.76) | MEN1KMT2AHPGDAGERMAPT | |
| SCHEMBL22639875 | 0.89 | MEN1 (0.72) | MEN1KMT2AHPGDAGERMAPT | |
| 2-Phenylimidazole SCHEMBL6691475 | 0.86 | MEN1 (0.59) | MEN1KMT2AHPGDAGERMAPT | |
| SCHEMBL28619302 | 0.84 | MEN1 (0.56) | MEN1KMT2AHPGDAGERMAPT | |
| SCHEMBL24982894 | 0.84 | MEN1 (0.59) | MEN1KMT2AHPGDAGERMAPT | |
| SCHEMBL22106302 | 0.84 | HPGD (0.63) | MEN1KMT2AHPGDAGERMAPT | |
| SCHEMBL28429464 | 0.83 | MEN1 (0.55) | MEN1KMT2AHPGDAGERMAPT | |
| SCHEMBL18821437 | 0.83 | AGER (0.59) | MEN1KMT2AHPGDAGERMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 313 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3713984-B1 | ADHESIVE TAPES BASED ON EPOXY RESIN REACTIVE ADHESIVES | TESA SE (DE) | 2023-11-01 | — | — | EP | claimed |
| US-20220306908-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2022-09-29 | — | — | US | claimed |
| US-20220275252-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2022-09-01 | — | — | US | claimed |
| WO-2021032727-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2021-02-25 | — | — | WO | claimed |
| WO-2021032822-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2021-02-25 | — | — | WO | claimed |
| EP-3713984-A1 | ADHESIVE TAPES BASED ON EPOXY RESIN REACTIVE ADHESIVES | TESA SE (DE) | 2020-09-30 | — | — | EP | claimed |
| US-8063161-B2 | Low temperature curing acrylate and maleimide based formulations and methods for use thereof | DESIGNER MOLECULES, INC. (US) | 2011-11-22 | — | — | US | claimed |
| US-20100063184-A1 | LOW TEMPERATURE CURING ACRYLATE AND MALEIMIDE BASED FORMULATIONS AND METHODS FOR USE THEREOF | DESIGNER MOLECULES, INC. (US) | 2010-03-11 | — | — | US | claimed |
| WO-2008130894-A1 | LOW TEMPERATURE CURING ACRYLATE AND MALEIMIDE BASED FORMULATIONS AND METHODS FOR USE THEREOF | DESIGNER MOLECULES, INC. (US) | 2008-10-30 | — | — | WO | claimed |
| US-4546155-A | ADDUCT OF EPOXY COMPOUND, TERTIARY AMINE COMPOUND, AND CARBOXYLIC ACID ANHYDRIDE | AJINOMOTO CO., INC. (JP) | 1985-10-08 | — | — | US | claimed |
| US-4542202-A | EPOXY COMPOUND WITH A HYDROXY, MERCAPTO, OR HYDRAZIDE MODIFIED TERTIARY AMINE | AJINOMOTO CO., INC. (JP) | 1985-09-17 | — | — | US | claimed |
| JP-63183920-A | — | — | None | — | — | JP | disclosed |
| EP-4748870-A1 | EPOXY RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2026-05-27 | — | — | EP | disclosed |
| EP-4748869-A1 | EPOXY RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED ARTICLE, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2026-05-27 | — | — | EP | disclosed |
| EP-4746003-A1 | COMPOUND, VARNISH, BOND MAGNET, AND MOTOR | Asahi Kasei Kabushiki Kaisha (JP) | 2026-05-20 | — | — | EP | disclosed |
| US-4689388-A | POLYHYDRAZIDE, LATENT CURING AGENT, DICYANDIAMIDE, IMIDAZOLE OR DERIVATIVE | AJINOMOTO CO., INC. (JP) | 1987-08-25 | — | — | US | disclosed |
| US-4546155-A | ADDUCT OF EPOXY COMPOUND, TERTIARY AMINE COMPOUND, AND CARBOXYLIC ACID ANHYDRIDE | AJINOMOTO CO., INC. (JP) | 1985-10-08 | — | — | US | disclosed |
| US-4542202-A | EPOXY COMPOUND WITH A HYDROXY, MERCAPTO, OR HYDRAZIDE MODIFIED TERTIARY AMINE | AJINOMOTO CO., INC. (JP) | 1985-09-17 | — | — | US | disclosed |
| EP-0138465-A2 | Latent curing agents for epoxy resins | AJINOMOTO CO., INC. (JP) | 1985-04-24 | — | — | EP | disclosed |
| EP-0104837-A2 | Latent curing agents for epoxy resins | AJINOMOTO CO., INC. (JP) | 1984-04-04 | — | — | EP | disclosed |