Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HIF1A | Q16665 | 2/20 | 0.75 |
| ▸ | HTT | P42858 | 1/20 | 0.64 |
| ▸ | CDK4 | P11802 | 3/20 | 0.60 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.60 |
| ▸ | HPGD | P15428 | 1/20 | 0.60 |
| ▸ | POLB | P06746 | 1/20 | 0.59 |
| ▸ | LMNA | P02545 | 1/20 | 0.58 |
| ▸ | CYP2D6 | P10635 | 2/20 | 0.56 |
| ▸ | ADRB2 | P07550 | 1/20 | 0.56 |
| ▸ | ADRB1 | P08588 | 1/20 | 0.56 |
| ▸ | ADRB3 | P13945 | 1/20 | 0.56 |
| ▸ | CDK2 | P24941 | 2/20 | 0.55 |
| ▸ | ABCB1 | P08183 | 1/20 | 0.52 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Benzamide SCHEMBL4775810 | 0.87 | HIF1A (0.58) | HIF1AHTTCDK4ALDH1A1HPGD | |
| SCHEMBL6264190 | 0.86 | HIF1A (0.57) | HIF1AHTTCDK4ALDH1A1HPGD | |
| SCHEMBL6552266 | 0.85 | ABCB1 (0.76) | HIF1AHTTCDK4ALDH1A1HPGD | |
| SCHEMBL11505627 | 0.84 | HIF1A (0.55) | HIF1AHTTCDK4POLBLMNA | |
| SCHEMBL21793185 | 0.84 | HIF1A (0.59) | HIF1AHTTCDK4CYP2D6ADRB2 | |
| SCHEMBL19405224 | 0.84 | CDK4 (0.67) | HIF1AHTTCDK4ALDH1A1HPGD | |
| SCHEMBL22639742 | 0.84 | CDK4 (0.67) | HIF1AHTTCDK4ALDH1A1HPGD | |
| Hydrochloric Acid SCHEMBL22228312 | 0.83 | ABCB1 (0.74) | HIF1AHTTCDK4ALDH1A1HPGD | |
| Chloromethane SCHEMBL8216574 | 0.82 | ABCB1 (0.72) | HIF1AHTTCDK4ALDH1A1HPGD | |
| SCHEMBL10760842 | 0.82 | POLB (0.78) | HIF1AALDH1A1POLBLMNACYP2D6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 267 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3713984-B1 | ADHESIVE TAPES BASED ON EPOXY RESIN REACTIVE ADHESIVES | TESA SE (DE) | 2023-11-01 | — | — | EP | claimed |
| US-20220306908-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2022-09-29 | — | — | US | claimed |
| US-20220275252-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2022-09-01 | — | — | US | claimed |
| WO-2021032822-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2021-02-25 | — | — | WO | claimed |
| WO-2021032727-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2021-02-25 | — | — | WO | claimed |
| EP-3713984-A1 | ADHESIVE TAPES BASED ON EPOXY RESIN REACTIVE ADHESIVES | TESA SE (DE) | 2020-09-30 | — | — | EP | claimed |
| CN-111087760-A | Epoxy resin system for wet winding and preparation method and application thereof | 北京光华纺织集团有限公司 | 2020-05-01 | — | — | CN | claimed |
| WO-2019101916-A1 | CURABLE COMPOSITION BASED ON FATTY-ACID MODIFIED EPOXY RESINS AND CURING AGENTS | TESA SE (DE) | 2019-05-31 | — | — | WO | claimed |
| WO-2019101914-A1 | ADHESIVE TAPES BASED ON EPOXY RESIN REACTIVE ADHESIVES | TESA SE (DE) | 2019-05-31 | — | — | WO | claimed |
| US-8063161-B2 | Low temperature curing acrylate and maleimide based formulations and methods for use thereof | DESIGNER MOLECULES, INC. (US) | 2011-11-22 | — | — | US | claimed |
| US-20100063184-A1 | LOW TEMPERATURE CURING ACRYLATE AND MALEIMIDE BASED FORMULATIONS AND METHODS FOR USE THEREOF | DESIGNER MOLECULES, INC. (US) | 2010-03-11 | — | — | US | claimed |
| WO-2008130894-A1 | LOW TEMPERATURE CURING ACRYLATE AND MALEIMIDE BASED FORMULATIONS AND METHODS FOR USE THEREOF | DESIGNER MOLECULES, INC. (US) | 2008-10-30 | — | — | WO | claimed |
| US-4546155-A | ADDUCT OF EPOXY COMPOUND, TERTIARY AMINE COMPOUND, AND CARBOXYLIC ACID ANHYDRIDE | AJINOMOTO CO., INC. (JP) | 1985-10-08 | — | — | US | claimed |
| US-4542202-A | EPOXY COMPOUND WITH A HYDROXY, MERCAPTO, OR HYDRAZIDE MODIFIED TERTIARY AMINE | AJINOMOTO CO., INC. (JP) | 1985-09-17 | — | — | US | claimed |
| EP-4748870-A1 | EPOXY RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2026-05-27 | — | — | EP | disclosed |
| EP-4748869-A1 | EPOXY RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED ARTICLE, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2026-05-27 | — | — | EP | disclosed |
| WO-2026100231-A1 | CURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-4542202-A | EPOXY COMPOUND WITH A HYDROXY, MERCAPTO, OR HYDRAZIDE MODIFIED TERTIARY AMINE | AJINOMOTO CO., INC. (JP) | 1985-09-17 | — | — | US | disclosed |
| EP-0138465-A2 | Latent curing agents for epoxy resins | AJINOMOTO CO., INC. (JP) | 1985-04-24 | — | — | EP | disclosed |
| EP-0104837-A2 | Latent curing agents for epoxy resins | AJINOMOTO CO., INC. (JP) | 1984-04-04 | — | — | EP | disclosed |