SCHEMBL25960249

SCHEMBL25960249

CCN(CCC[SiH3])C(=O)OC(C)(C)C

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA14 Q9ULX7 2/20 0.45
HDAC6 Q9UBN7 2/20 0.36
HDAC1 Q13547 2/20 0.36
HDAC2 Q92769 2/20 0.36
CA12 O43570 2/20 0.35
CA1 P00915 2/20 0.35
CA9 Q16790 1/20 0.35
NAMPT P43490 1/20 0.33
CA7 P43166 1/20 0.33
LMNA P02545 1/20 0.32
CTSK P43235 1/20 0.32
MEN1 O00255 1/20 0.32
KMT2A Q03164 1/20 0.32
SSTR4 P31391 1/20 0.32
HDAC3 O15379 1/20 0.31
NCOR2 Q9Y618 1/20 0.31
CYP1A2 P05177 1/20 0.31
CYP3A4 P08684 1/20 0.31
CYP2D6 P10635 1/20 0.31
CYP2C19 P33261 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25960251 0.88 CA14 (0.48) CA14HDAC6HDAC1HDAC2CA12
SCHEMBL25960250 0.88 CA14 (0.48) CA14HDAC6HDAC1HDAC2CA12
SCHEMBL15085740 0.87 CA14 (0.53) CA14HDAC6HDAC1HDAC2CA12
SCHEMBL25960285 0.86 CA14 (0.37) CA14CA12CA1CA9LMNA
SCHEMBL14175259 0.85 CA12 (0.50) CA14HDAC6HDAC1HDAC2CA12
SCHEMBL8850983 0.84 CA14 (0.54) CA14HDAC6HDAC1HDAC2CA12
SCHEMBL17814903 0.84 CA14 (0.50) CA14HDAC6HDAC1HDAC2CA12
SCHEMBL8628224 0.84 CA14 (0.54) CA14HDAC6HDAC1HDAC2CA12
SCHEMBL3551705 0.84 CA14 (0.50) CA14HDAC6HDAC1HDAC2CA12
SCHEMBL7867482 0.82 CA14 (0.45) CA14HDAC6HDAC1HDAC2CA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230244149-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-08-03 US disclosed