Alcohol

Alcohol

SCHEMBL2596791

CCO.CCOB(OCC)OCC

nearest known ligand 0.43

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

MMP1MMP13MMP7MMP8polrplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO

The experimentally established mechanism targets of Alcohol. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.43
TSHR P16473 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27913833 0.89 ALDH1A1 (0.32) ALDH1A1
SCHEMBL50777 0.89 ALDH1A1 (0.32) ALDH1A1
Boric Acid SCHEMBL27485400 0.86 ALDH1A1 (0.33) ALDH1A1
Water SCHEMBL28116863 0.85 ALDH1A1 (0.30) ALDH1A1
SCHEMBL3041911 0.85 ALDH1A1 (0.30) ALDH1A1
Fluoride SCHEMBL23120036 0.85 ALDH1A1 (0.30) ALDH1A1
SCHEMBL1056384 0.85 ALDH1A1 (0.30) ALDH1A1
SCHEMBL6154385 0.85 ALDH1A1 (0.30) ALDH1A1
Ammonia Solution, Strong SCHEMBL9328292 0.85 ALDH1A1 (0.30) ALDH1A1
SCHEMBL10843317 0.81

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111151924-B Low-volatility environment-friendly acid-washing-free soldering flux solution and preparation method and application thereof 浙江新锐焊接科技股份有限公司 2021-05-11 CN claimed
CN-111151924-A Low-volatility environment-friendly acid-washing-free soldering flux solution and preparation method and application thereof 浙江新锐焊接科技股份有限公司 2020-05-15 CN claimed
CN-216829291-U Pickling-free soldering flux spraying mechanism and pickling-free soldering flux automatic adding device 浙江新锐焊接科技股份有限公司 2022-06-28 CN disclosed
CN-114178751-A Pickling-free soldering flux spraying mechanism and pickling-free soldering flux automatic adding device 浙江新锐焊接科技股份有限公司 2022-03-15 CN disclosed
CN-111151924-B Low-volatility environment-friendly acid-washing-free soldering flux solution and preparation method and application thereof 浙江新锐焊接科技股份有限公司 2021-05-11 CN disclosed
CN-111151924-B Low-volatility environment-friendly acid-washing-free soldering flux solution and preparation method and application thereof 浙江新锐焊接科技股份有限公司 2021-05-11 CN disclosed
CN-111151924-A Low-volatility environment-friendly acid-washing-free soldering flux solution and preparation method and application thereof 浙江新锐焊接科技股份有限公司 2020-05-15 CN disclosed
CN-111151924-A Low-volatility environment-friendly acid-washing-free soldering flux solution and preparation method and application thereof 浙江新锐焊接科技股份有限公司 2020-05-15 CN disclosed
WO-2011144729-A2 PRESERVATIVE COMPOSITION KEMIRA OYJ (FI) 2011-11-24 WO disclosed