Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TP53 | P04637 | 3/20 | 0.39 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.39 |
| ▸ | MAPK1 | P28482 | 3/20 | 0.39 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.39 |
| ▸ | LMNA | P02545 | 2/20 | 0.39 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.39 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.39 |
| ▸ | NPC1 | O15118 | 2/20 | 0.39 |
| ▸ | RAB9A | P51151 | 2/20 | 0.39 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.39 |
| ▸ | THPO | P40225 | 1/20 | 0.39 |
| ▸ | PPM1B | O75688 | 1/20 | 0.39 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.39 |
| ▸ | PPP1CC | P36873 | 1/20 | 0.39 |
| ▸ | TFPI2 | P48307 | 1/20 | 0.39 |
| ▸ | PPP5C | P53041 | 1/20 | 0.39 |
| ▸ | PPP2CA | P67775 | 1/20 | 0.39 |
| ▸ | PPP1CA | P62136 | 1/20 | 0.39 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.39 |
| ▸ | GMNN | O75496 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13232077 | 0.75 | TP53 (0.37) | TP53CYP3A4MAPK1HIF1ALMNA | |
| SCHEMBL15947744 | 0.71 | TP53 (0.30) | TP53CYP3A4MAPK1HIF1ALMNA | |
| SCHEMBL13445945 | 0.69 | POLB (0.34) | — | |
| SCHEMBL10051185 | 0.67 | POLB (0.33) | — | |
| SCHEMBL18179610 | 0.67 | TP53 (0.31) | TP53CYP3A4MAPK1HIF1ALMNA | |
| SCHEMBL5119335 | 0.67 | TP53 (0.42) | TP53CYP3A4MAPK1HIF1ALMNA | |
| SCHEMBL8656933 | 0.67 | TP53 (0.31) | TP53CYP3A4MAPK1HIF1ALMNA | |
| SCHEMBL8656795 | 0.67 | TP53 (0.31) | TP53CYP3A4MAPK1HIF1ALMNA | |
| SCHEMBL8841260 | 0.65 | TP53 (0.35) | TP53CYP3A4MAPK1HIF1ALMNA | |
| SCHEMBL13224531 | 0.62 | TP53 (0.39) | TP53CYP3A4MAPK1HIF1ALMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 178 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12034115-B2 | Solid electrolyte composition, sheet for all-solid state secondary battery, electrode sheet for all-solid state secondary battery, and all-solid state secondary battery | FUJIFILM CORPORATION (JP) | 2024-07-09 | — | — | US | disclosed |
| US-20240213479-A1 | ELECTRODE COMPOSITION, ELECTRODE SHEET FOR ALL-SOLID STATE SECONDARY BATTERY, ALL-SOLID STATE SECONDARY BATTERY, AND MANUFACTURING METHODS FOR ELECTRODE COMPOSITION, ELECTRODE SHEET FOR ALL-SOLID STATE SECONDARY BATTERY, AND ALL-SOLID STATE SECONDARY BATTERY | FUJIFILM CORPORATION (JP) | 2024-06-27 | — | — | US | disclosed |
| US-20240018306-A1 | RESIN COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND METHOD FOR SYNTHESIZING POLYIMIDE PRECURSOR | RESONAC CORPORATION (JP) | 2024-01-18 | — | — | US | disclosed |
| US-20230374219-A1 | OPTICAL FILM INCLUDING POLYMER RESIN HAVING EXCELLENT DEGREE OF POLYMERIZATION, AND DISPLAY DEVICE INCLUDING SAME | KOLON INDUSTRIES, INC. (KR) | 2023-11-23 | — | — | US | disclosed |
| US-20230375750-A1 | OPTICAL FILM WITH IMPROVED OPTICAL PROPERTIES, DISPLAY APPARATUS COMPRISING SAME, AND MANUFACTURING METHOD THEREFOR | KOLON INDUSTRIES, INC. (KR) | 2023-11-23 | — | — | US | disclosed |
| US-20230359122-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT | HD MICROSYSTEMS, LTD. (JP) | 2023-11-09 | — | — | US | disclosed |
| US-11807721-B2 | Method for producing polyimide precursor, method for producing photosensitive resin composition, method for producing pattern cured product, method for producing interlayer insulating film, cover coat layer or surface protective film, and method for producing electronic component | HD MICROSYSTEMS, LTD. (JP) | 2023-11-07 | — | — | US | disclosed |
| US-20230350294-A1 | Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-11-02 | — | — | US | disclosed |
| US-20230338906-A1 | SEPARATION MEMBRANE | NITTO DENKO CORPORATION (JP) | 2023-10-26 | — | — | US | disclosed |
| US-11768434-B2 | Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-09-26 | — | — | US | disclosed |
| US-20070172753-A1 | Photosensitive resin composition and manufacturing method of semiconductor device using the same | FUJIFILM CORPORATION (JP) | 2007-07-26 | — | — | US | disclosed |
| US-7244495-B2 | Dicing/die bonding adhesion tape | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-07-17 | — | — | US | disclosed |
| US-20070120271-A1 | Dicing and die bonding adhesive tape | SHIN-ETSU CHEMICAL CO., LTD. | 2007-05-31 | — | — | US | disclosed |
| US-20070106057-A1 | Polyimide resin, method of producing polyimide resin, and electrolyte membrane, catalyst layer, membrane/electrode assembly and device each containing polyimide resin | YAMANASHI, UNIVERSITY OF (JP) | 2007-05-10 | — | — | US | disclosed |
| US-7215912-B2 | Intermediate transfer medium and image forming apparatus using the intermediate transfer medium | RICOH COMPANY LIMITED (JP) | 2007-05-08 | — | — | US | disclosed |
| US-20070090299-A1 | Adhesive composition and sheet having an adhesive layer of the composition | SHIN-ETSU CHEMICAL CO., LTD. | 2007-04-26 | — | — | US | disclosed |
| US-20070066796-A1 | Resin solution composition, polyimide resin, and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. | 2007-03-22 | — | — | US | disclosed |
| US-7189439-B2 | Active matrix type liquid crystal display apparatus | HITACHI, LTD. (JP) | 2007-03-13 | — | — | US | disclosed |
| US-20070048656-A1 | Photosensitive resin composition and method for manufacturing semiconductor device using the same | FUJI PHOTO FILM CO., LTD. | 2007-03-01 | — | — | US | disclosed |
| US-7157204-B2 | Soluble polyimide for photosensitive polyimide precursor and photosensitive polyimide precursor composition comprising the soluble polyimide | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-01-02 | — | — | US | disclosed |