SCHEMBL2598718

SCHEMBL2598718

C=COP(OC=C)OC=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2597662 0.78
SCHEMBL11425589 0.67
SCHEMBL2234700 0.62
SCHEMBL8002316 0.55
SCHEMBL299551 0.53
Vinyl Ether SCHEMBL19363 0.53
SCHEMBL6534672 0.53
Vinyl Ether SCHEMBL477946 0.53
Vinyl Ether SCHEMBL866680 0.50
Vinyl Ether SCHEMBL5709665 0.50

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12054611-B2 Poly(phenylene ether), curable composition containing poly(phenylene ether), dry film, prepreg, cured object, laminate, and electronic component TAIYO HOLDINGS CO., LTD. (JP) 2024-08-06 US disclosed
CN-117903297-A Chemoselective coupling of sulfhydryl groups with alkenyl or alkynyl phosphoramides 柏林合作研究学会 2024-04-19 CN disclosed
CN-112384552-B Polyphenylene ether, curable composition containing polyphenylene ether, dry film, prepreg, cured product, laminate, and electronic component 太阳控股株式会社 2024-01-30 CN disclosed
CN-109689112-B Chemoselective coupling of sulfhydryl groups with alkenyl or alkynyl phosphoramides 柏林合作研究学会 2023-10-13 CN disclosed
US-20220380538-A1 CURABLE COMPOSITION INCLUDING POLYPHENYLENE ETHER, DRY FILM, PREPREG, CURED PRODUCT, LAMINATED BOARD, AND ELECTRONIC COMPONENT TAIYO HOLDINGS CO., LTD. (JP) 2022-12-01 US disclosed
CN-114830826-A Photosensitive resin composition, cured film, organic EL display, display device, and method for producing cured film 东丽株式会社 2022-07-29 CN disclosed
US-9006372-B2 Silicone resins and their use in polymer compositions DOW CORNING (SHANGHAI) CO LTD (CN) 2015-04-14 US disclosed
EP-2593497-A1 SILICONE RESINS AND THEIR USE IN POLYMER COMPOSITIONS Dow Corning Corporation (US) 2013-05-22 EP disclosed
US-20130066009-A1 Silicone Resins And Their Use In Polymer Compositions DOW CORNING CORPORATION (US) 2013-03-14 US disclosed
WO-2011143931-A1 SILICONE RESINS AND THEIR USE IN POLYMER COMPOSITIONS DOW CORNING CORPORATION (US) 2011-11-24 WO disclosed
US-4808638-A CROSSLINKING WITH POLYMERCAPTANS LOCTITE CORPORATION (US) 1989-02-28 US disclosed