Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LTA4H | P09960 | 5/20 | 0.45 |
| ▸ | TSHR | P16473 | 1/20 | 0.45 |
| ▸ | CA4 | P22748 | 1/20 | 0.41 |
| ▸ | KCNA3 | P22001 | 1/20 | 0.38 |
| ▸ | CA5A | P35218 | 1/20 | 0.36 |
| ▸ | CA5B | Q9Y2D0 | 1/20 | 0.36 |
| ▸ | NR1H2 | P55055 | 1/20 | 0.35 |
| ▸ | BAX | Q07812 | 1/20 | 0.35 |
| ▸ | MAOA | P21397 | 1/20 | 0.35 |
| ▸ | CA1 | P00915 | 2/20 | 0.33 |
| ▸ | CA2 | P00918 | 2/20 | 0.33 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | RECQL | P46063 | 1/20 | 0.33 |
| ▸ | CA9 | Q16790 | 1/20 | 0.33 |
| ▸ | SRC | P12931 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.32 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.32 |
| ▸ | MAOB | P27338 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14264186 | 0.85 | CA4 (0.46) | LTA4HTSHRCA4KCNA3CA5A | |
| SCHEMBL14264187 | 0.84 | LTA4H (0.50) | LTA4HL3MBTL1 | |
| SCHEMBL3067331 | 0.78 | LTA4H (0.41) | LTA4HTSHRCA4KCNA3CA5A | |
| SCHEMBL3068223 | 0.78 | LTA4H (0.41) | LTA4HTSHRCA4KCNA3CA5A | |
| SCHEMBL3081706 | 0.78 | LTA4H (0.41) | LTA4HTSHRCA4KCNA3CA5A | |
| SCHEMBL20943 | 0.77 | LTA4H (0.45) | LTA4HTSHRCA4KCNA3CA5A | |
| Benzene SCHEMBL11134259 | 0.77 | LTA4H (0.45) | LTA4HTSHRCA4KCNA3CA5A | |
| SCHEMBL29790853 | 0.77 | LTA4H (0.45) | LTA4HTSHRCA4KCNA3CA5A | |
| SCHEMBL13805761 | 0.74 | LTA4H (0.43) | LTA4HTSHRCA4KCNA3NR1H2 | |
| SCHEMBL11350262 | 0.74 | LTA4H (0.43) | LTA4HTSHRCA4KCNA3CA5A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240209184-A1 | ALIPHATIC COPOLYAMIDE COMPOSITION | BASF SE (DE) | 2024-06-27 | — | — | US | disclosed |
| WO-2023237603-A1 | RECYCLING METHOD FOR PRODUCING A POLYAMIDE COMPOUND | BASF SE (DE) | 2023-12-14 | — | — | WO | disclosed |
| US-11718748-B2 | Composition, method for the manufacture thereof, and articles made therefrom | SABIC GLOBAL TECHNOLOGIES B.V. (NL) | 2023-08-08 | — | — | US | disclosed |
| US-11718748-B2 | Composition, method for the manufacture thereof, and articles made therefrom | SABIC GLOBAL TECHNOLOGIES B.V. (NL) | 2023-08-08 | — | — | US | disclosed |
| US-20230121614-A1 | COMPOSITION, METHOD FOR THE MANUFACTURE THEREOF, AND ARTICLES MADE THEREFROM | SHPP GLOBAL TECHNOLOGIES B.V. (NL) | 2023-04-20 | — | — | US | disclosed |
| WO-2021191209-A1 | HEAT-AGING RESISTANT POLYAMIDE MOLDING COMPOSITIONS | BASF SE (DE) | 2021-09-30 | — | — | WO | disclosed |
| EP-3448930-B1 | POLY(PHENYLENE ETHER) COMPOSITION AND ARTICLE | SABIC GLOBAL TECHNOLOGIES BV (NL) | 2020-11-11 | — | — | EP | disclosed |
| US-20200224006-A1 | FLAME-RETARDANT POLYAMIDE MOLDING COMPOUNDS | BASF SE (DE) | 2020-07-16 | — | — | US | disclosed |
| EP-3137546-B1 | FLAME-RETARDANT POLYESTER COMPOSITION AND ARTICLE | SABIC GLOBAL TECHNOLOGIES BV (NL) | 2018-07-04 | — | — | EP | disclosed |
| WO-2017187286-A1 | POLY(PHENYLENE ETHER) COMPOSITION AND ARTICLE | SABIC GLOBAL TECHNOLOGIES B.V. (NL) | 2017-11-02 | — | — | WO | disclosed |
| US-7449506-B2 | Flame-retardant polycarbonate resin composition | SUMITOMO DOW LIMITED (JP) | 2008-11-11 | — | — | US | disclosed |
| US-7449506-B2 | Flame-retardant polycarbonate resin composition | SUMITOMO DOW LIMITED (JP) | 2008-11-11 | — | — | US | disclosed |
| US-20080241759-A1 | METHOD OF MANUFACTURING WIRING CIRCUIT BOARD | NITTO DENKO CORPORATION (JP) | 2008-10-02 | — | — | US | disclosed |
| EP-1975700-A2 | Method of manufacturing wiring circuit board | NITTO DENKO CORPORATION (JP) | 2008-10-01 | — | — | EP | disclosed |
| US-7345102-B2 | Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same | NITTO DENKO CORPORATION (JP) | 2008-03-18 | — | — | US | disclosed |
| US-20080063955-A1 | PHOTOSENSITIVE RESIN COMPOSITION FOR FLEXIBLE CIRCUIT BOARD AND FLEXIBLE CIRCUIT BOARD USING THE SAME | NITTO DENKO CORPORATION (JP) | 2008-03-13 | — | — | US | disclosed |
| EP-1894972-A2 | Photosensitive resin composition for flexible circuit board and flexible circuit board using the same | NITTO DENKO CORPORATION (JP) | 2008-03-05 | — | — | EP | disclosed |
| EP-1894952-A1 | Photosensitive resin composition for flexible circuit board and flexible circuit board using the same | NITTO DENKO CORPORATION (JP) | 2008-03-05 | — | — | EP | disclosed |
| US-20080051495-A1 | Flame Retardant Resin Composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2008-02-28 | — | — | US | disclosed |
| US-7247666-B2 | Flame retardant resin composition | MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) | 2007-07-24 | — | — | US | disclosed |