Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.35 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.33 |
| ▸ | POLB | P06746 | 1/20 | 0.31 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.31 |
| ▸ | MEN1 | O00255 | 1/20 | 0.31 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL439901 | 0.97 | TSHR (0.36) | TSHREPHX1POLBHSD17B10MEN1 | |
| SCHEMBL6015433 | 0.91 | TSHR (0.33) | TSHREPHX1 | |
| Ethylene Glycol SCHEMBL464873 | 0.89 | EPHX1 (0.39) | TSHREPHX1POLBHSD17B10MEN1 | |
| SCHEMBL213172 | 0.88 | TSHR (0.34) | TSHREPHX1POLBHSD17B10MEN1 | |
| SCHEMBL16123667 | 0.88 | TSHR (0.31) | TSHR | |
| SCHEMBL12394593 | 0.88 | TSHR (0.34) | TSHREPHX1POLBHSD17B10MEN1 | |
| SCHEMBL1130527 | 0.88 | TSHR (0.34) | TSHREPHX1POLBHSD17B10MEN1 | |
| SCHEMBL2734301 | 0.87 | TSHR (0.32) | TSHR | |
| SCHEMBL12264016 | 0.87 | EPHX1 (0.43) | TSHREPHX1 | |
| SCHEMBL217129 | 0.86 | TSHR (0.33) | TSHREPHX1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230307407-A1 | MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METHOD FOR FORMING CONDUCTIVE LAYER | RICOH COMPANY, LTD. (JP) | 2023-09-28 | — | — | US | disclosed |
| US-20230307407-A1 | MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METHOD FOR FORMING CONDUCTIVE LAYER | RICOH COMPANY, LTD. (JP) | 2023-09-28 | — | — | US | disclosed |