SCHEMBL26190076

SCHEMBL26190076

O=C(OCCCCOC(=O)c1cccc(-c2cccc(C(=O)OCCCOC(=O)c3ccccc3)c2)c1)c1ccccc1

nearest known ligand 0.73

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.73
LMNA P02545 1/20 0.54
CNR2 P34972 1/20 0.54
KMO O15229 1/20 0.53
NPC1 O15118 2/20 0.50
RAB9A P51151 2/20 0.50
KDM4E B2RXH2 1/20 0.48
ALDH1A1 P00352 1/20 0.48
SMN1; SMN2 Q16637 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27337977 0.88 CNR2 (0.67) TDP1LMNACNR2ALDH1A1
SCHEMBL21312288 0.87 TDP1 (0.59) TDP1LMNACNR2KMONPC1
SCHEMBL16724888 0.86 CNR2 (0.65) TDP1LMNACNR2NPC1RAB9A
SCHEMBL15907642 0.86 CNR2 (0.65) TDP1LMNACNR2NPC1RAB9A
SCHEMBL416566 0.86 TDP1 (0.91) TDP1LMNANPC1RAB9AALDH1A1
SCHEMBL223441 0.86 TDP1 (1.00) TDP1LMNAALDH1A1SMN1; SMN2
SCHEMBL21312111 0.85 TDP1 (0.53) TDP1LMNACNR2KMONPC1
SCHEMBL21312671 0.85 TDP1 (0.53) TDP1LMNACNR2KMONPC1
SCHEMBL212972 0.84 TDP1 (0.69) TDP1LMNA
SCHEMBL15902429 0.84 CNR2 (0.62) TDP1LMNACNR2NPC1RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240019782-A1 Composition For Forming Metal Oxide Film, Patterning Process, And Method For Forming Metal Oxide Film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-01-18 US disclosed
US-20230274936-A1 PLANARIZING AGENT FOR FORMING ORGANIC FILM, COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FILM, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-08-31 US disclosed