Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13245862 | 1.00 | ALDH1A1 (0.39) | ALDH1A1POLB | |
| SCHEMBL3284105 | 0.93 | ALDH1A1 (0.36) | ALDH1A1POLB | |
| SCHEMBL16743392 | 0.88 | ALDH1A1 (0.36) | ALDH1A1POLB | |
| SCHEMBL12675656 | 0.85 | ALDH1A1 (0.35) | ALDH1A1POLB | |
| SCHEMBL21409754 | 0.84 | ALDH1A1 (0.31) | ALDH1A1POLB | |
| SCHEMBL14871990 | 0.84 | ALDH1A1 (0.36) | ALDH1A1POLB | |
| SCHEMBL17028796 | 0.81 | FNTA (0.30) | — | |
| SCHEMBL25377765 | 0.79 | — | — | |
| SCHEMBL19751372 | 0.79 | ALDH1A1 (0.33) | ALDH1A1POLB | |
| SCHEMBL23618061 | 0.77 | ALDH1A1 (0.33) | ALDH1A1POLB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 2555 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260085209-A1 | POLYIMIDE AND METHOD OF MANUFACTURE | ESSEX SOLUTIONS USA LLC (US) | 2026-03-26 | — | — | US | claimed |
| US-20260085208-A1 | POLYIMIDE AND METHOD OF MANUFACTURE | ESSEX SOLUTIONS USA LLC (US) | 2026-03-26 | — | — | US | claimed |
| US-20250346788-A1 | POLYMALEIMIDE RESIN, RESIN COMPOSITION, CURED OBJECT, SHEET, LAMINATE, AND PRINTED WIRING BOARD | RESONAC CORP (JP) | 2025-11-13 | — | — | US | claimed |
| US-20250341777-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR ELEMENT | RESONAC CORP (JP) | 2025-11-06 | — | — | US | claimed |
| CN-119931586-A | Preparation method of polyamide imide-polyimide copolymer resin adhesive and semiconductor element temporary packaging adhesive film | 芜湖徽氏新材料科技有限公司 | 2025-05-06 | — | — | CN | claimed |
| CN-116354864-B | Diamine containing intramolecular imide ring and aliphatic alkyl group, polyimide formed based on diamine, preparation method and application thereof | 天津科技大学 | 2024-12-13 | — | — | CN | claimed |
| CN-108803240-B | Photosensitive resin composition | 株式会社东进世美肯 | 2024-12-03 | — | — | CN | claimed |
| CN-119072659-A | Photosensitive resin composition, cured product, and semiconductor element | 株式会社力森诺科 | 2024-12-03 | — | — | CN | claimed |
| CN-119072519-A | Polymaleimide resin, resin composition, cured product, sheet, laminate, and printed wiring board | 株式会社力森诺科 | 2024-12-03 | — | — | CN | claimed |
| US-20240336599-A1 | PHOTOSENSITIVE POLYAMIC ACID AND DIAZIRINE COMPOSITIONS | PROMERUS, LLC (US) | 2024-10-10 | — | — | US | claimed |
| US-5455290-A | Using an anhydride curing agent comprising fine particles; storage stability; powder coatings; dielectrics | SOMAR CORPORATION (JP) | 1995-10-03 | — | — | US | claimed |
| US-5409965-A | Abrasion resistant coating composition comprising a caboxylate-containing polyfunctional acrylate and silica sol | MITSUBISHI PETROCHEMICAL CO., LTD. (JP) | 1995-04-25 | — | — | US | claimed |
| US-4966928-A | REACTION PRODUCT OF DICYCLOPENTADIENE AND MALEIC ANHYDRIDE, CURE ACCELERATOR, FILLER, IMPACT MODIFIER, SURFACE SMOOTHING AGENT | SOMAR CORPORATION (JP) | 1990-10-30 | — | — | US | claimed |
| US-4952611-A | AROMATIC DIAMINES AND ESTERS OF TETRACARBOXYLIC ACUDS ABD DICARBOXYLIC CYCLOHEXENYL SUCCINIC ACID | ETHYL CORPORATION (US) | 1990-08-28 | — | — | US | claimed |
| WO-1990002121-A1 | RHEOLOGICAL ADDITIVE FOR COATING COMPOSITIONS | NL CHEMICALS, INC. (US) | 1990-03-08 | — | — | WO | claimed |
| US-4866104-A | FLEXIBILITY, SOFTNESS | ETHYL CORPORATION (US) | 1989-09-12 | — | — | US | claimed |
| US-4826886-A | AIRCRAFT SEAT CUSHIONS | ETHYL CORPORATION (US) | 1989-05-02 | — | — | US | claimed |
| US-4654409-A | RESISTANCE TO ACIDS, HOT WATER | DAINIPPON INK AND CHEMICALS, INC. (JP) | 1987-03-31 | — | — | US | claimed |
| US-4546155-A | ADDUCT OF EPOXY COMPOUND, TERTIARY AMINE COMPOUND, AND CARBOXYLIC ACID ANHYDRIDE | AJINOMOTO CO., INC. (JP) | 1985-10-08 | — | — | US | claimed |
| EP-0138465-A2 | Latent curing agents for epoxy resins | AJINOMOTO CO., INC. (JP) | 1985-04-24 | — | — | EP | claimed |