Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALPL | P05186 | 1/20 | 0.33 |
| ▸ | SOS1 | Q07889 | 1/20 | 0.30 |
| ▸ | SOS2 | Q07890 | 1/20 | 0.30 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22641431 | 1.00 | ALPL (0.33) | ALPLSOS1SOS2ALDH1A1 | |
| SCHEMBL10187638 | 1.00 | — | — | |
| SCHEMBL22641427 | 1.00 | ALPL (0.33) | ALPLSOS1SOS2ALDH1A1 | |
| Hydrochloric Acid SCHEMBL572007 | 0.97 | ALPL (0.32) | ALPL | |
| SCHEMBL989854 | 0.97 | — | — | |
| Iodide SCHEMBL23270643 | 0.94 | — | — | |
| Water SCHEMBL21518343 | 0.94 | — | — | |
| Hydrochloric Acid SCHEMBL15228854 | 0.94 | — | — | |
| Bromide SCHEMBL11117953 | 0.94 | — | — | |
| SCHEMBL28513414 | 0.94 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230350294-A1 | Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-11-02 | — | — | US | disclosed |
| US-20230350294-A1 | Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-11-02 | — | — | US | disclosed |
| US-11768434-B2 | Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-09-26 | — | — | US | disclosed |