SCHEMBL26327443

SCHEMBL26327443

CC1(C)OCCCc2ccccc21

nearest known ligand 0.46

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
KDM1A O60341 3/20 0.46
MEN1 O00255 2/20 0.41
KMT2A Q03164 2/20 0.41
TSHR P16473 1/20 0.39
ALDH1A1 P00352 2/20 0.37
TP53 P04637 1/20 0.36
SIGMAR1 Q99720 1/20 0.36
HTR2A P28223 1/20 0.36
AKR1B1 P15121 1/20 0.36
TMEM97 Q5BJF2 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1867559 0.88 SIGMAR1 (0.43) KDM1AALDH1A1TP53SIGMAR1HTR2A
SCHEMBL30387985 0.88 SIGMAR1 (0.43) KDM1AALDH1A1TP53SIGMAR1HTR2A
SCHEMBL2619379 0.75 HTR2A (0.41) SIGMAR1HTR2A
SCHEMBL30869312 0.75 HTR2A (0.41) SIGMAR1HTR2A
SCHEMBL17014522 0.72 SIGMAR1 (0.50) KDM1ASIGMAR1AKR1B1TMEM97
SCHEMBL11197926 0.71 KDM1A (0.51) KDM1AMEN1KMT2ASIGMAR1AKR1B1
SCHEMBL4666807 0.70 SIGMAR1 (0.48) KDM1ASIGMAR1HTR2ATMEM97
SCHEMBL578812 0.69 KDM1A (0.59) KDM1AMEN1KMT2ATSHRTP53
SCHEMBL29556050 0.69 KDM1A (0.59) KDM1AMEN1KMT2ATSHRTP53
SCHEMBL24125124 0.69 SIGMAR1 (0.41) KDM1AALDH1A1TP53SIGMAR1HTR2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230350294-A1 Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-11-02 US disclosed
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 US disclosed