SCHEMBL26331351

SCHEMBL26331351

CN1c2ccccc2C(C)(C)c2cc(-c3ccc4c(c3)C(C)(C)c3ccccc3C4=O)ccc21

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ MAPT P10636 6/20 0.41
▸ MEN1 O00255 5/20 0.41
▸ KMT2A Q03164 5/20 0.41
▸ HTT P42858 3/20 0.41
▸ USP2 O75604 3/20 0.41
▸ POLB P06746 3/20 0.41
▸ SMN1; SMN2 Q16637 2/20 0.41
▸ NPC1 O15118 1/20 0.41
▸ RAB9A P51151 1/20 0.41
▸ LMNA P02545 3/20 0.40
▸ CREBBP Q92793 1/20 0.39
▸ PDE4A P27815 2/20 0.38
▸ PDE4B Q07343 2/20 0.38
▸ PDE4C Q08493 2/20 0.38
▸ PDE4D Q08499 2/20 0.38
▸ PGR P06401 2/20 0.37
▸ CHEK1 O14757 1/20 0.37
▸ TTR P02766 1/20 0.37
▸ CES1 P23141 1/20 0.37
▸ TSHR P16473 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26705358 0.86 MAPT (0.41) MAPTMEN1KMT2AHTTUSP2
SCHEMBL14702110 0.84 PDK2 (0.42) MAPTMEN1KMT2AHTTSMN1; SMN2
SCHEMBL17853028 0.81 HTT (0.44) MAPTMEN1KMT2AHTTUSP2
SCHEMBL22797541 0.81 NPC1 (0.51) MAPTMEN1KMT2AHTTSMN1; SMN2
SCHEMBL12177771 0.80 NPC1 (0.42) MAPTMEN1KMT2AHTTSMN1; SMN2
SCHEMBL17752301 0.78 NPC1 (0.47) MAPTMEN1KMT2AHTTSMN1; SMN2
SCHEMBL12177773 0.78 MEN1 (0.43) MAPTMEN1KMT2AHTTSMN1; SMN2
SCHEMBL16017948 0.78 NPC1 (0.47) MAPTMEN1KMT2AHTTSMN1; SMN2
SCHEMBL12177677 0.77 MEN1 (0.47) MAPTMEN1KMT2AHTTSMN1; SMN2
SCHEMBL28440785 0.77 MAOB (0.46) MAPTMEN1KMT2AHTTSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 — — US disclosed
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