SCHEMBL26430567

SCHEMBL26430567

CCCC[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)CCCOC(=O)C(C)(C)CC

nearest known ligand 0.34

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.33
ACHE P22303 6/20 0.31
ATM Q13315 1/20 0.31
NAAA Q02083 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26487781 0.96 CYP4F2 (0.32)
SCHEMBL13129215 0.93 ALDH1A1 (0.35) ALDH1A1ACHEATMNAAA
SCHEMBL12583594 0.91
SCHEMBL16349682 0.91
SCHEMBL20276225 0.91
SCHEMBL17639955 0.91
SCHEMBL20276247 0.91
SCHEMBL12404227 0.90 CYP4F2 (0.30)
SCHEMBL20276245 0.88 CYP4F2 (0.34) ALDH1A1
SCHEMBL12192518 0.87

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11783958-B2 Conductive wiring material composition, conductive wiring substrate and method for producing conductive wiring substrate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-10-10 US disclosed