SCHEMBL26490966

SCHEMBL26490966

O=C(OC(CS(=O)(=O)O)C(F)(F)F)C1C2CC3C(OS(=O)(=O)C31)C2O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25844952 0.83 — —
SCHEMBL26312799 0.82 — —
SCHEMBL25844751 0.82 — —
SCHEMBL18775734 0.80 — —
SCHEMBL19756037 0.78 — —
SCHEMBL21286962 0.77 — —
SCHEMBL18775756 0.77 — —
SCHEMBL25527898 0.74 — —
SCHEMBL25476169 0.74 — —
SCHEMBL25844954 0.70 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230140810-A1 MATERIAL FOR FORMING ADHESIVE FILM, PATTERNING PROCESS, AND METHOD FOR FORMING ADHESIVE FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-04 — — US disclosed
US-20230140810-A1 MATERIAL FOR FORMING ADHESIVE FILM, PATTERNING PROCESS, AND METHOD FOR FORMING ADHESIVE FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-04 — — US disclosed
Send feedback