⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL51890 | 0.80 | — | — | |
| SCHEMBL26922201 | 0.76 | — | — | |
| SCHEMBL51786 | 0.76 | — | — | |
| SCHEMBL11729933 | 0.75 | — | — | |
| SCHEMBL51221 | 0.72 | — | — | |
| SCHEMBL51412 | 0.69 | — | — | |
| SCHEMBL7696170 | 0.67 | — | — | |
| SCHEMBL23640147 | 0.66 | OGA (0.35) | — | |
| SCHEMBL21391580 | 0.64 | LGALS1 (0.42) | — | |
| SCHEMBL12672708 | 0.64 | LGALS1 (0.42) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 58 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8173756-B2 | Photopolymerizable monomers having epoxide and unsaturated double bonds and their composition | INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY (KR) | 2012-05-08 | — | — | US | disclosed |
| US-20090163683-A1 | PHOTOPOLYMERIZABLE MONOMERS HAVING EPOXIDE AND UNSATURATED DOUBLE BONDS AND THEIR COMPOSITION | INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY (KR) | 2009-06-25 | — | — | US | disclosed |
| CN-100335559-C | High optical contrast resin composition and electronic package utilizing same | IBM (US) | 2007-09-05 | — | — | CN | disclosed |
| US-6337375-B1 | RESIN WITH COLOR AND FLUORESCING AGENT | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2002-01-08 | — | — | US | disclosed |
| US-6190759-B1 | ELECTRONIC PACKAGE COMPRISING DIELECTRIC LAYER AND CONDUCTIVE LAYER, SAID DIELECTRIC LAYER INCLUDING REINFORCING MATERIAL, RESIN MATERIAL SELECTED FROM EPOXY, CYANATE AND BISMALEIMIDE RESINS, COLORING AGENT, AND FLUORESCING AGENT | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2001-02-20 | — | — | US | disclosed |
| US-6187417-B1 | Substrate having high optical contrast and method of making same | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2001-02-13 | — | — | US | disclosed |
| CN-1226580-A | High optical contrast resin composition and electronic package utilizing same | IBM (US) | 1999-08-25 | — | — | CN | disclosed |
| US-5629355-A | Polymeric sulfonium salt photoinitiators | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1997-05-13 | — | — | US | disclosed |
| US-5605781-A | Photosensitive composition with cyanate esters and use thereof | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1997-02-25 | — | — | US | disclosed |
| EP-0375929-B1 | Method for patterning cationic curable photoresist | IBM (US) | 1997-01-29 | — | — | EP | disclosed |
| US-4390675-A | EPOXYFULVENE, ACID CATALYST | ASHLAND OIL, INC. (US) | 1983-06-28 | — | — | US | disclosed |
| EP-0053280-A1 | Sealing composition, method for preparing said composition, integrated circuit module sealed therewith, and process for sealing | International Business Machines Corporation (US) | 1982-06-09 | — | — | EP | disclosed |
| US-4293457-A | POLYESTER; AMINOPLAST CURING AGENT; THERMOPLASTIC ACRYLIC POLYMER; CELLULOSE ACETATE BUTYRATE, EPOXY RESIN, OR VINYL ESTER-VINYL HALIDE COPOLYMER | PPG INDUSTRIES, INC. (US) | 1981-10-06 | — | — | US | disclosed |
| US-4292230-A | Screen-printing composition and use thereof | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1981-09-29 | — | — | US | disclosed |
| US-4246147-A | Screenable and strippable solder mask and use thereof | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1981-01-20 | — | — | US | disclosed |
| EP-0019802-A2 | Soldering mask composition to be processed by a screen printing process and subsequently removed and process for producing a removable soldering mask | International Business Machines Corporation (US) | 1980-12-10 | — | — | EP | disclosed |
| US-4237216-A | Photosensitive patternable coating composition containing novolak type materials | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1980-12-02 | — | — | US | disclosed |
| US-4232090-A | Sealerless primers | PPG INDUSTRIES, INC. (US) | 1980-11-04 | — | — | US | disclosed |
| EP-0009190-A1 | Curable composition useful for screen-printing, a cured coating comprising said composition and process for soldering printed circuit boards using said composition | International Business Machines Corporation (US) | 1980-04-02 | — | — | EP | disclosed |
| US-4187258-A | AMINOPLAST CURING AGENT; POLYESTER, POLYETHER, OR POLYURETHANE, THERMOPLASTIC ACRYLIC RESIN | PPG INDUSTRIES, INC. (US) | 1980-02-05 | — | — | US | disclosed |