SCHEMBL2679865

SCHEMBL2679865

O=C1CCC(S)O1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20288631 0.84
SCHEMBL9973225 0.71 CA1 (0.55)
SCHEMBL6854823 0.71 CA1 (0.55)
SCHEMBL16120995 0.71 CA1 (0.55)
SCHEMBL6857004 0.71 CA1 (0.55)
SCHEMBL7643331 0.71 CA1 (0.55)
SCHEMBL10583357 0.69
SCHEMBL7493544 0.67
SCHEMBL24996798 0.67
SCHEMBL6982780 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113848681-B Photosensitive resin composition, dry film and cured film thereof, and printed wiring board using the same 太阳控股株式会社 2024-09-03 CN disclosed
CN-115167076-A Photosensitive resin composition and photosensitive dry film resist laminate 杭州福斯特电子材料有限公司 2022-10-11 CN disclosed
WO-2022211082-A1 PHOTOSENSITIVE FILM LAMINATED BODY, CURED PRODUCT, AND PRINTED CIRCUIT BOARD 太陽インキ製造株式会社 2022-10-06 WO disclosed
CN-113848681-A Photosensitive resin composition, dry film and cured coating film thereof, and printed wiring board using same 太阳油墨制造株式会社 2021-12-28 CN disclosed
CN-106716251-B Photosensitive resin composition, dry film and cured coating film thereof, and printed wiring board using same 太阳油墨制造株式会社 2021-11-05 CN disclosed
CN-113614639-A Laminated structure, cured product, printed circuit board, and electronic component 太阳油墨制造株式会社 2021-11-05 CN disclosed
CN-109563222-B Photocurable resin composition, dry film, cured product, and printed wiring board 太阳油墨制造株式会社 2021-10-15 CN disclosed
CN-107129665-B Curable resin composition 东京应化工业株式会社 2020-11-24 CN disclosed
CN-105739239-B Photocurable/thermosetting resin composition, dry film, cured product, and printed wiring board 太阳油墨(苏州)有限公司 2020-04-03 CN disclosed
CN-105467753-B Photocurable/thermosetting resin composition, dry film, cured product, and printed wiring board 太阳油墨(苏州)有限公司 2020-01-14 CN disclosed
US-20120301824-A1 LAYERED STRUCTURE AND PHOTOSENSITIVE DRY FILM TO BE USED THEREFOR TAIYO HOLDINGS CO., LTD. (JP) 2012-11-29 US disclosed
US-20120301825-A1 LAYERED STRUCTURE AND PHOTOSENSITIVE DRY FILM TO BE USED THEREFOR TAIYO HOLDINGS CO., LTD. (JP) 2012-11-29 US disclosed
US-20120250268-A1 PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM THEREOF, AND PRINTED WIRING BOARD USING THEM TAIYO HOLDINGS CO., LTD. (JP) 2012-10-04 US disclosed
US-20120125672-A1 PHOTOCURABLE RESIN COMPOSITION TAIYO HOLDINGS CO., LTD. (JP) 2012-05-24 US disclosed
US-20120111620-A1 PHOTOCURABLE RESIN COMPOSITION TAIYO HOLDINGS CO., LTD. (JP) 2012-05-10 US disclosed
US-20080085251-A1 even at a neutral to weakly acidic pH; a lactone or lactam having a mercapto group; with thioglycolic acid, thiolactic acid, cysteine, acetylcysteine, cysteamine, acylcysteamine; RESONAC CORPORATION (JP) 2008-04-10 US disclosed
EP-1827370-A1 HAIR PROCESSING AGENT AND METHOD FOR PERMANENT WAVING HAIR Showa Denko K.K. (JP) 2007-09-05 EP disclosed
WO-2006068276-A1 HAIR PROCESSING AGENT AND METHOD FOR PERMANENT WAVING HAIR SHOWA DENKO K.K. (JP) 2006-06-29 WO disclosed
EP-1173430-A1 ENANTIOMERS OF MERCAPTO LACTONES AND PROCESSES FOR THEIR SYNTHESIS GLAXO GROUP LIMITED (GB) 2002-01-23 EP disclosed
WO-2000064882-A2 ENANTIOMERS OF MERCAPTO LACTONES AND PROCESSES FOR THEIR SYNTHESIS GLAXO GROUP LIMITED (GB) 2000-11-02 WO disclosed